JPS6161847U - - Google Patents

Info

Publication number
JPS6161847U
JPS6161847U JP1984146667U JP14666784U JPS6161847U JP S6161847 U JPS6161847 U JP S6161847U JP 1984146667 U JP1984146667 U JP 1984146667U JP 14666784 U JP14666784 U JP 14666784U JP S6161847 U JPS6161847 U JP S6161847U
Authority
JP
Japan
Prior art keywords
support plate
electrode
diode chip
integrated
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984146667U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322925Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146667U priority Critical patent/JPH0322925Y2/ja
Publication of JPS6161847U publication Critical patent/JPS6161847U/ja
Application granted granted Critical
Publication of JPH0322925Y2 publication Critical patent/JPH0322925Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/646—Dispositions of strap connectors the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Rectifiers (AREA)
JP1984146667U 1984-09-28 1984-09-28 Expired JPH0322925Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (https=) 1984-09-28 1984-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (https=) 1984-09-28 1984-09-28

Publications (2)

Publication Number Publication Date
JPS6161847U true JPS6161847U (https=) 1986-04-25
JPH0322925Y2 JPH0322925Y2 (https=) 1991-05-20

Family

ID=30704901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146667U Expired JPH0322925Y2 (https=) 1984-09-28 1984-09-28

Country Status (1)

Country Link
JP (1) JPH0322925Y2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115183U (https=) * 1988-01-28 1989-08-02
JPH0682862U (ja) * 1991-03-14 1994-11-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP2014072349A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置
JP2014072350A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (https=) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (https=) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115183U (https=) * 1988-01-28 1989-08-02
JPH0682862U (ja) * 1991-03-14 1994-11-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP2014072349A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置
JP2014072350A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0322925Y2 (https=) 1991-05-20

Similar Documents

Publication Publication Date Title
JPS6161847U (https=)
JPS6016568U (ja) 光起電力装置
JPS60119200U (ja) 圧電発音体
JPS62122359U (https=)
JPS6054347U (ja) 光起電力装置
JPS59169053U (ja) 複合パワ−トランジスタ装置
JPS6122370U (ja) 光起電力素子
JPH01120334U (https=)
JPS609226U (ja) 半導体の実装用パツケ−ジ
JPH03112951U (https=)
JPS60174254U (ja) 電力用半導体装置
JPH02102734U (https=)
JPS6139949U (ja) 半導体装置
JPS60125754U (ja) 半導体装置
JPH0231152U (https=)
JPS6373943U (https=)
JPS6183046U (https=)
JPS59192853U (ja) 半導体素子
JPH0233434U (https=)
JPH0298635U (https=)
JPH0373444U (https=)
JPS6260033U (https=)
JPS6063975U (ja) リ−ド板
JPS60931U (ja) 半導体装置
JPS61102055U (https=)