JPS6159862A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6159862A
JPS6159862A JP59181972A JP18197284A JPS6159862A JP S6159862 A JPS6159862 A JP S6159862A JP 59181972 A JP59181972 A JP 59181972A JP 18197284 A JP18197284 A JP 18197284A JP S6159862 A JPS6159862 A JP S6159862A
Authority
JP
Japan
Prior art keywords
package
semiconductor device
chip
chips
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59181972A
Other languages
English (en)
Japanese (ja)
Other versions
JPH053142B2 (cg-RX-API-DMAC10.html
Inventor
Junji Sakurai
桜井　潤治
Ryoichi Mukai
良一 向井
Tetsuo Izawa
哲夫 伊澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59181972A priority Critical patent/JPS6159862A/ja
Publication of JPS6159862A publication Critical patent/JPS6159862A/ja
Publication of JPH053142B2 publication Critical patent/JPH053142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W72/00—
    • H10W72/01—
    • H10W72/834—
    • H10W90/20—
    • H10W90/231—
    • H10W90/291—
    • H10W90/732—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP59181972A 1984-08-31 1984-08-31 半導体装置 Granted JPS6159862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59181972A JPS6159862A (ja) 1984-08-31 1984-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59181972A JPS6159862A (ja) 1984-08-31 1984-08-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS6159862A true JPS6159862A (ja) 1986-03-27
JPH053142B2 JPH053142B2 (cg-RX-API-DMAC10.html) 1993-01-14

Family

ID=16110083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59181972A Granted JPS6159862A (ja) 1984-08-31 1984-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS6159862A (cg-RX-API-DMAC10.html)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956695A (en) * 1989-05-12 1990-09-11 Rockwell International Corporation Three-dimensional packaging of focal plane assemblies using ceramic spacers
US5295045A (en) * 1990-11-14 1994-03-15 Hitachi, Ltd. Plastic-molded-type semiconductor device and producing method therefor
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US6340846B1 (en) 2000-12-06 2002-01-22 Amkor Technology, Inc. Making semiconductor packages with stacked dies and reinforced wire bonds
US6395578B1 (en) 1999-05-20 2002-05-28 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US6577013B1 (en) 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US20160379933A1 (en) * 2007-02-21 2016-12-29 Amkor Technology, Inc. Semiconductor package in package

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956695A (en) * 1989-05-12 1990-09-11 Rockwell International Corporation Three-dimensional packaging of focal plane assemblies using ceramic spacers
US5295045A (en) * 1990-11-14 1994-03-15 Hitachi, Ltd. Plastic-molded-type semiconductor device and producing method therefor
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US6395578B1 (en) 1999-05-20 2002-05-28 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
US6762078B2 (en) 1999-05-20 2004-07-13 Amkor Technology, Inc. Semiconductor package having semiconductor chip within central aperture of substrate
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US6803254B2 (en) 1999-12-20 2004-10-12 Amkor Technology, Inc. Wire bonding method for a semiconductor package
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires
US6650019B2 (en) 2000-07-20 2003-11-18 Amkor Technology, Inc. Method of making a semiconductor package including stacked semiconductor dies
US6577013B1 (en) 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US6340846B1 (en) 2000-12-06 2002-01-22 Amkor Technology, Inc. Making semiconductor packages with stacked dies and reinforced wire bonds
US20160379933A1 (en) * 2007-02-21 2016-12-29 Amkor Technology, Inc. Semiconductor package in package
US9768124B2 (en) 2007-02-21 2017-09-19 Amkor Technology, Inc. Semiconductor package in package

Also Published As

Publication number Publication date
JPH053142B2 (cg-RX-API-DMAC10.html) 1993-01-14

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