JPS6366422B2 - - Google Patents

Info

Publication number
JPS6366422B2
JPS6366422B2 JP56043096A JP4309681A JPS6366422B2 JP S6366422 B2 JPS6366422 B2 JP S6366422B2 JP 56043096 A JP56043096 A JP 56043096A JP 4309681 A JP4309681 A JP 4309681A JP S6366422 B2 JPS6366422 B2 JP S6366422B2
Authority
JP
Japan
Prior art keywords
tape
ring
metal
assembly
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56043096A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56150836A (en
Inventor
Danieru Baanzu Kaamen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JPS56150836A publication Critical patent/JPS56150836A/ja
Publication of JPS6366422B2 publication Critical patent/JPS6366422B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701—
    • H10W70/421—
    • H10W72/0711—
    • H10W72/077—
    • H10W95/00—
    • H10W70/682—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4309681A 1980-03-24 1981-03-24 Method of assembling tape for semiconductor device and assembly tape Granted JPS56150836A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/133,053 US4355463A (en) 1980-03-24 1980-03-24 Process for hermetically encapsulating semiconductor devices

Publications (2)

Publication Number Publication Date
JPS56150836A JPS56150836A (en) 1981-11-21
JPS6366422B2 true JPS6366422B2 (cg-RX-API-DMAC10.html) 1988-12-20

Family

ID=22456800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4309681A Granted JPS56150836A (en) 1980-03-24 1981-03-24 Method of assembling tape for semiconductor device and assembly tape

Country Status (3)

Country Link
US (1) US4355463A (cg-RX-API-DMAC10.html)
JP (1) JPS56150836A (cg-RX-API-DMAC10.html)
GB (1) GB2072423B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190140832A (ko) * 2018-06-12 2019-12-20 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190140832A (ko) * 2018-06-12 2019-12-20 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물

Also Published As

Publication number Publication date
US4355463A (en) 1982-10-26
JPS56150836A (en) 1981-11-21
GB2072423B (en) 1983-11-23
GB2072423A (en) 1981-09-30

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