JPS6157670A - フレキシブル印刷配線板用接着剤組成物 - Google Patents
フレキシブル印刷配線板用接着剤組成物Info
- Publication number
- JPS6157670A JPS6157670A JP17749884A JP17749884A JPS6157670A JP S6157670 A JPS6157670 A JP S6157670A JP 17749884 A JP17749884 A JP 17749884A JP 17749884 A JP17749884 A JP 17749884A JP S6157670 A JPS6157670 A JP S6157670A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flexible printed
- alcohol
- epoxy resin
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 title claims description 28
- 230000001070 adhesive effect Effects 0.000 title claims description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 abstract description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004952 Polyamide Substances 0.000 abstract description 4
- 229920002647 polyamide Polymers 0.000 abstract description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 239000004843 novolac epoxy resin Substances 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 239000012752 auxiliary agent Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000002075 main ingredient Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004959 Rilsan Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004846 water-soluble epoxy resin Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17749884A JPS6157670A (ja) | 1984-08-28 | 1984-08-28 | フレキシブル印刷配線板用接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17749884A JPS6157670A (ja) | 1984-08-28 | 1984-08-28 | フレキシブル印刷配線板用接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157670A true JPS6157670A (ja) | 1986-03-24 |
| JPH0562156B2 JPH0562156B2 (https=) | 1993-09-07 |
Family
ID=16031952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17749884A Granted JPS6157670A (ja) | 1984-08-28 | 1984-08-28 | フレキシブル印刷配線板用接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157670A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02291191A (ja) * | 1989-04-28 | 1990-11-30 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板の製造方法 |
| JPH02291192A (ja) * | 1989-04-28 | 1990-11-30 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板の製造方法 |
| WO2008047700A1 (fr) * | 2006-10-20 | 2008-04-24 | Air Water Inc. | Résine phénolique granulaire non-thermofusible, son procédé de fabrication, composition de résine thermodurcissable, matériau d'étanchéité pour semiconducteur, et adhésif pour semiconducteur |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08308127A (ja) * | 1995-04-28 | 1996-11-22 | Sani Clean Honbu:Kk | ニッケル・カドミウム電池自動充電装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS573877A (en) * | 1980-06-09 | 1982-01-09 | Toshiba Chem Corp | Thermosetting adhesive |
-
1984
- 1984-08-28 JP JP17749884A patent/JPS6157670A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS573877A (en) * | 1980-06-09 | 1982-01-09 | Toshiba Chem Corp | Thermosetting adhesive |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02291191A (ja) * | 1989-04-28 | 1990-11-30 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板の製造方法 |
| JPH02291192A (ja) * | 1989-04-28 | 1990-11-30 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板の製造方法 |
| WO2008047700A1 (fr) * | 2006-10-20 | 2008-04-24 | Air Water Inc. | Résine phénolique granulaire non-thermofusible, son procédé de fabrication, composition de résine thermodurcissable, matériau d'étanchéité pour semiconducteur, et adhésif pour semiconducteur |
| US8158095B2 (en) | 2006-10-20 | 2012-04-17 | Air Water Inc. | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| US8293860B2 (en) | 2006-10-20 | 2012-10-23 | Air Water Inc. | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| US8411415B2 (en) | 2006-10-20 | 2013-04-02 | Air Water Inc. | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| US8409756B2 (en) | 2006-10-20 | 2013-04-02 | Air Water Inc. | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| US8658120B2 (en) | 2006-10-20 | 2014-02-25 | Air Water Inc. | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0562156B2 (https=) | 1993-09-07 |
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