JPS573877A - Thermosetting adhesive - Google Patents

Thermosetting adhesive

Info

Publication number
JPS573877A
JPS573877A JP7744380A JP7744380A JPS573877A JP S573877 A JPS573877 A JP S573877A JP 7744380 A JP7744380 A JP 7744380A JP 7744380 A JP7744380 A JP 7744380A JP S573877 A JPS573877 A JP S573877A
Authority
JP
Japan
Prior art keywords
resin
soluble
alcohol
adhesive
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7744380A
Other languages
Japanese (ja)
Inventor
Itsuo Matsuda
Kichinosuke Soma
Yutaka Nomi
Masahisa Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP7744380A priority Critical patent/JPS573877A/en
Publication of JPS573877A publication Critical patent/JPS573877A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The titled adhesive comprising an alcohol-soluble polyamide resin and phenol resin, a water-soluble epoxy resin and a euring agent of the epoxy resin, being of one-pack type simple and convenient to use, and having excellent chemical resistance.
CONSTITUTION: 25W65wt% Alcohol-soluble polyamide resin (A), 10W38wt% alcohol-soluble phenol resin (B) (e.g., a novolac type resin obtained from phenol and formal-dehyde) and 15W50wt% water-soluble epoxy resin (C) are dissolved in a solvent such as methanol or the like. Subsequently, a euring agent of resin C (e.g., dicyandiamide, etc.) is added to and dissolved uniformly in the solution to obtain a thermosetting adhesive. The adhesive is of one-pack type simple and convenient to use and provides excellent chemical resistance.
COPYRIGHT: (C)1982,JPO&Japio
JP7744380A 1980-06-09 1980-06-09 Thermosetting adhesive Pending JPS573877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7744380A JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7744380A JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Publications (1)

Publication Number Publication Date
JPS573877A true JPS573877A (en) 1982-01-09

Family

ID=13634157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7744380A Pending JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Country Status (1)

Country Link
JP (1) JPS573877A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JPS6157670A (en) * 1984-08-28 1986-03-24 Toshiba Chem Corp Adhesive composition for flexible printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board
JPS5571771A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition
JPS5571772A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board
JPS5571771A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition
JPS5571772A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JPH0240099B2 (en) * 1982-05-10 1990-09-10 Makhteshim Chem Works Ltd
JPS6157670A (en) * 1984-08-28 1986-03-24 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPH0562156B2 (en) * 1984-08-28 1993-09-07 Toshiba Chem Prod

Similar Documents

Publication Publication Date Title
JPS5356288A (en) Preparation of phenolic resin
JPS573877A (en) Thermosetting adhesive
JPS5413600A (en) Fpoxy resin hardener
JPS5323399A (en) Aqueous anticorrosive epoxy resin compositions containing tannin
JPS56157425A (en) Curable resin composition
JPS57187376A (en) Adhesive composition
JPS5278934A (en) Adhesive composition for chemical plating
JPS5589363A (en) Coating composition for metallic can
JPS5527364A (en) Epoxy resin curing agent
JPS5380499A (en) Hardening of epoxy compound
JPS5421498A (en) Liquid epoxy resin
JPS54133592A (en) Preparation of novolak-type phenolic resin
JPS56104979A (en) Thermosetting adhesive
JPS57128763A (en) Adhesive for resin-rich wood
JPS5280395A (en) Preparation of water-soluble resol resins
JPS5545710A (en) Thermosetting resin composition
JPS5266600A (en) Epoxy resin compositions
JPS5792019A (en) Preparation of imidazole mixture assuming liquidity at room temperature
JPS5643343A (en) Preparation of amino resin composition
JPS56129263A (en) Paint for can
JPS53106788A (en) Preparation of water soluble resol resin
JPS56125461A (en) Can paint
JPS54111599A (en) Epoxy resin curing agent
JPS5388091A (en) Preparation of phenolic resin
JPS53119954A (en) Thermosetting epoxy resin emulsion composition