JPS573877A - Thermosetting adhesive - Google Patents
Thermosetting adhesiveInfo
- Publication number
- JPS573877A JPS573877A JP7744380A JP7744380A JPS573877A JP S573877 A JPS573877 A JP S573877A JP 7744380 A JP7744380 A JP 7744380A JP 7744380 A JP7744380 A JP 7744380A JP S573877 A JPS573877 A JP S573877A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- soluble
- alcohol
- adhesive
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The titled adhesive comprising an alcohol-soluble polyamide resin and phenol resin, a water-soluble epoxy resin and a euring agent of the epoxy resin, being of one-pack type simple and convenient to use, and having excellent chemical resistance.
CONSTITUTION: 25W65wt% Alcohol-soluble polyamide resin (A), 10W38wt% alcohol-soluble phenol resin (B) (e.g., a novolac type resin obtained from phenol and formal-dehyde) and 15W50wt% water-soluble epoxy resin (C) are dissolved in a solvent such as methanol or the like. Subsequently, a euring agent of resin C (e.g., dicyandiamide, etc.) is added to and dissolved uniformly in the solution to obtain a thermosetting adhesive. The adhesive is of one-pack type simple and convenient to use and provides excellent chemical resistance.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7744380A JPS573877A (en) | 1980-06-09 | 1980-06-09 | Thermosetting adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7744380A JPS573877A (en) | 1980-06-09 | 1980-06-09 | Thermosetting adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS573877A true JPS573877A (en) | 1982-01-09 |
Family
ID=13634157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7744380A Pending JPS573877A (en) | 1980-06-09 | 1980-06-09 | Thermosetting adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS573877A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930857A (en) * | 1982-05-10 | 1984-02-18 | マハトスヒム・ケミカル・ワ−クス・リミテツド | Manufacture of flame retardant thermoplastic nylon resin and composition therefor |
JPS6157670A (en) * | 1984-08-28 | 1986-03-24 | Toshiba Chem Corp | Adhesive composition for flexible printed circuit board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125285A (en) * | 1978-03-23 | 1979-09-28 | Hitachi Chem Co Ltd | Manufacturing of flexible printed circuit board |
JPS5571771A (en) * | 1978-11-27 | 1980-05-30 | Yokohama Rubber Co Ltd:The | Adhesive composition |
JPS5571772A (en) * | 1978-11-27 | 1980-05-30 | Yokohama Rubber Co Ltd:The | Adhesive composition |
-
1980
- 1980-06-09 JP JP7744380A patent/JPS573877A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125285A (en) * | 1978-03-23 | 1979-09-28 | Hitachi Chem Co Ltd | Manufacturing of flexible printed circuit board |
JPS5571771A (en) * | 1978-11-27 | 1980-05-30 | Yokohama Rubber Co Ltd:The | Adhesive composition |
JPS5571772A (en) * | 1978-11-27 | 1980-05-30 | Yokohama Rubber Co Ltd:The | Adhesive composition |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930857A (en) * | 1982-05-10 | 1984-02-18 | マハトスヒム・ケミカル・ワ−クス・リミテツド | Manufacture of flame retardant thermoplastic nylon resin and composition therefor |
JPH0240099B2 (en) * | 1982-05-10 | 1990-09-10 | Makhteshim Chem Works Ltd | |
JPS6157670A (en) * | 1984-08-28 | 1986-03-24 | Toshiba Chem Corp | Adhesive composition for flexible printed circuit board |
JPH0562156B2 (en) * | 1984-08-28 | 1993-09-07 | Toshiba Chem Prod |
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