JPS5571772A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS5571772A
JPS5571772A JP14533278A JP14533278A JPS5571772A JP S5571772 A JPS5571772 A JP S5571772A JP 14533278 A JP14533278 A JP 14533278A JP 14533278 A JP14533278 A JP 14533278A JP S5571772 A JPS5571772 A JP S5571772A
Authority
JP
Japan
Prior art keywords
epoxy resin
adhesive composition
copolymer
alkenylphenol
ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14533278A
Other languages
Japanese (ja)
Other versions
JPS5728515B2 (en
Inventor
Kunio Kageyama
Shigeo Omote
Yoshiaki Someya
Tetsuo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP14533278A priority Critical patent/JPS5571772A/en
Publication of JPS5571772A publication Critical patent/JPS5571772A/en
Publication of JPS5728515B2 publication Critical patent/JPS5728515B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: An epoxy resin, an alkenylphenol polymer or copolymer and a nylon polyamide resin are incorporated in a specific proportion to increase the adhesion strength, heat resistance and durability of the resulting adhesive composition.
CONSTITUTION: (a) An epoxy resin as a condensate between bisphenol-A and epichlorohydrin, or novolak type epoxy resin, (b) a polymer from an alkenylphenol as n-propenylphenol or n-butenylphenol or copolymer thereof with styrene or acrylonitrile and (c) a nylon polyamide resin as Amylan CM 4000 or Diamide, in which the ratio of a/c is 30/100W200/100 by wt and the ratio of epoxy groups of component a/hydroxyl groups of component b ranges from 2W20 in equivalent.
COPYRIGHT: (C)1980,JPO&Japio
JP14533278A 1978-11-27 1978-11-27 Adhesive composition Granted JPS5571772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14533278A JPS5571772A (en) 1978-11-27 1978-11-27 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14533278A JPS5571772A (en) 1978-11-27 1978-11-27 Adhesive composition

Publications (2)

Publication Number Publication Date
JPS5571772A true JPS5571772A (en) 1980-05-30
JPS5728515B2 JPS5728515B2 (en) 1982-06-17

Family

ID=15382712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14533278A Granted JPS5571772A (en) 1978-11-27 1978-11-27 Adhesive composition

Country Status (1)

Country Link
JP (1) JPS5571772A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573877A (en) * 1980-06-09 1982-01-09 Toshiba Chem Corp Thermosetting adhesive
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JP2016505087A (en) * 2013-01-29 2016-02-18 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Fixing agent composition and primer composition for metal plastic hybrid member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573877A (en) * 1980-06-09 1982-01-09 Toshiba Chem Corp Thermosetting adhesive
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JPH0240099B2 (en) * 1982-05-10 1990-09-10 Makhteshim Chem Works Ltd
JP2016505087A (en) * 2013-01-29 2016-02-18 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Fixing agent composition and primer composition for metal plastic hybrid member
US10273390B2 (en) 2013-01-29 2019-04-30 Evonik Degussa Gmbh Adhesion promoter compositions and primer compositions for metal-plastic hybrid components
US11078390B2 (en) 2013-01-29 2021-08-03 Evonik Operations Gmbh Adhesion promoter compositions and primer compositions for metal-plastic hybrid components

Also Published As

Publication number Publication date
JPS5728515B2 (en) 1982-06-17

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