JPS6154259B2 - - Google Patents

Info

Publication number
JPS6154259B2
JPS6154259B2 JP54074113A JP7411379A JPS6154259B2 JP S6154259 B2 JPS6154259 B2 JP S6154259B2 JP 54074113 A JP54074113 A JP 54074113A JP 7411379 A JP7411379 A JP 7411379A JP S6154259 B2 JPS6154259 B2 JP S6154259B2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
thickness
sealed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54074113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55165654A (en
Inventor
Yasuhisa Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7411379A priority Critical patent/JPS55165654A/ja
Publication of JPS55165654A publication Critical patent/JPS55165654A/ja
Publication of JPS6154259B2 publication Critical patent/JPS6154259B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W74/10—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7411379A 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin Granted JPS55165654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7411379A JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7411379A JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Publications (2)

Publication Number Publication Date
JPS55165654A JPS55165654A (en) 1980-12-24
JPS6154259B2 true JPS6154259B2 (enExample) 1986-11-21

Family

ID=13537813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7411379A Granted JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Country Status (1)

Country Link
JP (1) JPS55165654A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160053A (en) * 1980-05-14 1981-12-09 Hitachi Ltd Resin sealing type semiconductor device
JPS5861654A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置
WO1992020205A1 (en) * 1991-04-26 1992-11-12 Motorola, Inc. Tapered semiconductor device package

Also Published As

Publication number Publication date
JPS55165654A (en) 1980-12-24

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