JPS55165654A - Semiconductor device sealed up with thin resin - Google Patents

Semiconductor device sealed up with thin resin

Info

Publication number
JPS55165654A
JPS55165654A JP7411379A JP7411379A JPS55165654A JP S55165654 A JPS55165654 A JP S55165654A JP 7411379 A JP7411379 A JP 7411379A JP 7411379 A JP7411379 A JP 7411379A JP S55165654 A JPS55165654 A JP S55165654A
Authority
JP
Japan
Prior art keywords
thickness
resin portion
resin
seal
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7411379A
Other languages
Japanese (ja)
Other versions
JPS6154259B2 (en
Inventor
Yasuhisa Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7411379A priority Critical patent/JPS55165654A/en
Publication of JPS55165654A publication Critical patent/JPS55165654A/en
Publication of JPS6154259B2 publication Critical patent/JPS6154259B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent warp and thickness change, by reducing the thickness of a thicker seal-up resin portion, which sandwiches a lead frame together with a thinner seal-up resin portion, toward the quadrilateral periphery of the thickner resin portion. CONSTITUTION:Seal-up resin 1 has a partial thickness t1 above a side of a lead frame 2 and another partial thickness t2 below the side. The total thickness of the resin is t3. The edges of the periphery of four corners of the upper quadrilateral seal-up resin portion, whose thickness t1 is larger than that t2 of the other portion, are flatly or roundly cut to reduce the thickness of the edge section of the upper seal-up resin portion. Although the thicker resin portion is rovided on the pellet mounting side of the lead frame and the thinner resin portion is provided on the other side, the mechanical strength does not fall. Since the thickness of the peripheral section of the resin is small, only little warp occurs.
JP7411379A 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin Granted JPS55165654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7411379A JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7411379A JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Publications (2)

Publication Number Publication Date
JPS55165654A true JPS55165654A (en) 1980-12-24
JPS6154259B2 JPS6154259B2 (en) 1986-11-21

Family

ID=13537813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7411379A Granted JPS55165654A (en) 1979-06-12 1979-06-12 Semiconductor device sealed up with thin resin

Country Status (1)

Country Link
JP (1) JPS55165654A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160053A (en) * 1980-05-14 1981-12-09 Hitachi Ltd Resin sealing type semiconductor device
JPS5861654A (en) * 1981-10-09 1983-04-12 Toshiba Corp Semiconductor device
WO1992020205A1 (en) * 1991-04-26 1992-11-12 Motorola, Inc. Tapered semiconductor device package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160053A (en) * 1980-05-14 1981-12-09 Hitachi Ltd Resin sealing type semiconductor device
JPS5861654A (en) * 1981-10-09 1983-04-12 Toshiba Corp Semiconductor device
JPH0159741B2 (en) * 1981-10-09 1989-12-19 Tokyo Shibaura Electric Co
WO1992020205A1 (en) * 1991-04-26 1992-11-12 Motorola, Inc. Tapered semiconductor device package

Also Published As

Publication number Publication date
JPS6154259B2 (en) 1986-11-21

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