JPS6153852B2 - - Google Patents
Info
- Publication number
- JPS6153852B2 JPS6153852B2 JP14131378A JP14131378A JPS6153852B2 JP S6153852 B2 JPS6153852 B2 JP S6153852B2 JP 14131378 A JP14131378 A JP 14131378A JP 14131378 A JP14131378 A JP 14131378A JP S6153852 B2 JPS6153852 B2 JP S6153852B2
- Authority
- JP
- Japan
- Prior art keywords
- leadless
- package
- wiring board
- printed wiring
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5567154A JPS5567154A (en) | 1980-05-21 |
JPS6153852B2 true JPS6153852B2 (es) | 1986-11-19 |
Family
ID=15288986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14131378A Granted JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5567154A (es) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0282876U (es) * | 1988-12-15 | 1990-06-27 | ||
JPH0530286Y2 (es) * | 1987-10-30 | 1993-08-03 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6027433U (ja) * | 1983-07-29 | 1985-02-25 | 松下電工株式会社 | 電子部品の実装構造 |
JPS6078141U (ja) * | 1983-10-31 | 1985-05-31 | 松下電工株式会社 | 電子部品の実装構造 |
KR100226782B1 (ko) * | 1996-12-06 | 1999-10-15 | 김영환 | 반도체 패키지의 구조 |
-
1978
- 1978-11-15 JP JP14131378A patent/JPS5567154A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0530286Y2 (es) * | 1987-10-30 | 1993-08-03 | ||
JPH0282876U (es) * | 1988-12-15 | 1990-06-27 |
Also Published As
Publication number | Publication date |
---|---|
JPS5567154A (en) | 1980-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5519936A (en) | Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | |
US5773884A (en) | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | |
US6519161B1 (en) | Molded electronic package, method of preparation and method of shielding-II | |
JPS62216259A (ja) | 混成集積回路の製造方法および構造 | |
JPH0945805A (ja) | 配線基板、半導体装置及び半導体装置を配線基板から取り外す方法並びに半導体装置の製造方法 | |
JPS6153852B2 (es) | ||
JPH0210571B2 (es) | ||
JPH1051034A (ja) | 面実装型電子部品、その製造方法、これを回路基板上に実装する方法、およびこれを実装した回路基板 | |
US20040119155A1 (en) | Metal wiring board and method for manufacturing the same | |
JP2676107B2 (ja) | 電子部品搭載用基板 | |
JP2652223B2 (ja) | 電子部品搭載用基板 | |
JPH01312892A (ja) | 回路基板の製造方法 | |
JPS59123291A (ja) | 電子機器用回路基板 | |
JPH02260592A (ja) | 回路基板 | |
JP2779843B2 (ja) | 電子部品搭載用基板及び電子部品パッケージ | |
JPH09260529A (ja) | 半導体装置用基板及び半導体装置 | |
JPS6293993A (ja) | 電子回路装置とその実装方法 | |
JPH0955448A (ja) | 半導体装置の製造方法 | |
JPS5941888A (ja) | 電子回路板及びその製造方法 | |
JPH0536300Y2 (es) | ||
JP3174975B2 (ja) | 電子部品搭載装置 | |
JPH118459A (ja) | 表面実装部品のプリント配線板への実装構造 | |
JPH07115254A (ja) | プリント回路基板の接続構造 | |
JPS5999787A (ja) | 厚膜配線基板 | |
JPH0514391B2 (es) |