JPS6153852B2 - - Google Patents
Info
- Publication number
- JPS6153852B2 JPS6153852B2 JP14131378A JP14131378A JPS6153852B2 JP S6153852 B2 JPS6153852 B2 JP S6153852B2 JP 14131378 A JP14131378 A JP 14131378A JP 14131378 A JP14131378 A JP 14131378A JP S6153852 B2 JPS6153852 B2 JP S6153852B2
- Authority
- JP
- Japan
- Prior art keywords
- leadless
- package
- wiring board
- printed wiring
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5567154A JPS5567154A (en) | 1980-05-21 |
| JPS6153852B2 true JPS6153852B2 (es) | 1986-11-19 |
Family
ID=15288986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14131378A Granted JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5567154A (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282876U (es) * | 1988-12-15 | 1990-06-27 | ||
| JPH0530286Y2 (es) * | 1987-10-30 | 1993-08-03 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027433U (ja) * | 1983-07-29 | 1985-02-25 | 松下電工株式会社 | 電子部品の実装構造 |
| JPS6078141U (ja) * | 1983-10-31 | 1985-05-31 | 松下電工株式会社 | 電子部品の実装構造 |
| KR100226782B1 (ko) * | 1996-12-06 | 1999-10-15 | 김영환 | 반도체 패키지의 구조 |
-
1978
- 1978-11-15 JP JP14131378A patent/JPS5567154A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530286Y2 (es) * | 1987-10-30 | 1993-08-03 | ||
| JPH0282876U (es) * | 1988-12-15 | 1990-06-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5567154A (en) | 1980-05-21 |
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