JPS6149499A - フレキシブル多層配線基板 - Google Patents
フレキシブル多層配線基板Info
- Publication number
- JPS6149499A JPS6149499A JP17118884A JP17118884A JPS6149499A JP S6149499 A JPS6149499 A JP S6149499A JP 17118884 A JP17118884 A JP 17118884A JP 17118884 A JP17118884 A JP 17118884A JP S6149499 A JPS6149499 A JP S6149499A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- flexible wiring
- wiring boards
- conductive
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 10
- 239000002923 metal particle Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118884A JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118884A JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6149499A true JPS6149499A (ja) | 1986-03-11 |
| JPH0464199B2 JPH0464199B2 (en, 2012) | 1992-10-14 |
Family
ID=15918631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17118884A Granted JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149499A (en, 2012) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
| JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
-
1984
- 1984-08-17 JP JP17118884A patent/JPS6149499A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
| JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0464199B2 (en, 2012) | 1992-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |