JPS6149499A - フレキシブル多層配線基板 - Google Patents
フレキシブル多層配線基板Info
- Publication number
- JPS6149499A JPS6149499A JP17118884A JP17118884A JPS6149499A JP S6149499 A JPS6149499 A JP S6149499A JP 17118884 A JP17118884 A JP 17118884A JP 17118884 A JP17118884 A JP 17118884A JP S6149499 A JPS6149499 A JP S6149499A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- flexible wiring
- wiring boards
- conductive
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 10
- 239000002923 metal particle Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17118884A JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17118884A JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6149499A true JPS6149499A (ja) | 1986-03-11 |
JPH0464199B2 JPH0464199B2 (enrdf_load_stackoverflow) | 1992-10-14 |
Family
ID=15918631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17118884A Granted JPS6149499A (ja) | 1984-08-17 | 1984-08-17 | フレキシブル多層配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6149499A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
-
1984
- 1984-08-17 JP JP17118884A patent/JPS6149499A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPH0464199B2 (enrdf_load_stackoverflow) | 1992-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5780776A (en) | Multilayer circuit board unit | |
US6861284B2 (en) | Semiconductor device and production method thereof | |
US8178191B2 (en) | Multilayer wiring board and method of making the same | |
US5637834A (en) | Multilayer circuit substrate and method for forming same | |
KR970014494A (ko) | 다층회로기판 및 그 제조방법 | |
JPH1056099A (ja) | 多層回路基板およびその製造方法 | |
JP2001332866A (ja) | 回路基板及びその製造方法 | |
JPH06120670A (ja) | 多層配線基板 | |
JP3930222B2 (ja) | 半導体装置の製造方法 | |
JP3490309B2 (ja) | 配線基板およびその製造方法 | |
JP3554650B2 (ja) | 回路基板 | |
JPS6149499A (ja) | フレキシブル多層配線基板 | |
JPS5930555Y2 (ja) | プリント基板 | |
JPH02164096A (ja) | 多層電子回路基板とその製造方法 | |
JPS5823956B2 (ja) | インサツハイセンバン | |
JPS6364079B2 (enrdf_load_stackoverflow) | ||
US20020166697A1 (en) | Circuit board construction | |
JP4176283B2 (ja) | 可撓性微細多層回路基板の製造法 | |
JP3959697B2 (ja) | 半導体装置及び半導体装置の製造方法並びに配線基板 | |
CN117641770A (zh) | 电路板的制作方法以及电路板 | |
JPH03101195A (ja) | 多層プリント配線基板の接続方法 | |
JPH04137660A (ja) | 電子回路装置 | |
JPH0517902Y2 (enrdf_load_stackoverflow) | ||
JPH0314292A (ja) | 高密度実装モジュールの製造方法 | |
JPH03204996A (ja) | 金属ベース多層回路基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |