JPS6147000B2 - - Google Patents
Info
- Publication number
- JPS6147000B2 JPS6147000B2 JP53072101A JP7210178A JPS6147000B2 JP S6147000 B2 JPS6147000 B2 JP S6147000B2 JP 53072101 A JP53072101 A JP 53072101A JP 7210178 A JP7210178 A JP 7210178A JP S6147000 B2 JPS6147000 B2 JP S6147000B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- prepreg
- circuit board
- multilayer printed
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7210178A JPS54163359A (en) | 1978-06-16 | 1978-06-16 | Method of producing multiilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7210178A JPS54163359A (en) | 1978-06-16 | 1978-06-16 | Method of producing multiilayer printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54163359A JPS54163359A (en) | 1979-12-25 |
JPS6147000B2 true JPS6147000B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-10-16 |
Family
ID=13479670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7210178A Granted JPS54163359A (en) | 1978-06-16 | 1978-06-16 | Method of producing multiilayer printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54163359A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710294A (en) * | 1980-06-23 | 1982-01-19 | Furukawa Electric Co Ltd | Method of producing flexible printed circuit board |
JPS58140193A (ja) * | 1982-02-16 | 1983-08-19 | 富士通株式会社 | 高密度多層プリント板 |
JPS5948996A (ja) * | 1982-09-13 | 1984-03-21 | 日本電気株式会社 | 多層プリント配線板およびその製造方法 |
JPS59187170U (ja) * | 1983-05-30 | 1984-12-12 | 日本メクトロン株式会社 | 多層回路基板 |
JPS6390897A (ja) * | 1986-10-03 | 1988-04-21 | 松下電工株式会社 | 多層配線板の製造方法 |
JP2509885B2 (ja) * | 1987-06-26 | 1996-06-26 | 東芝ケミカル株式会社 | 多層銅張積層板 |
JPS6480524A (en) * | 1987-09-24 | 1989-03-27 | Matsushita Electric Works Ltd | Multi-layer printed wiring board |
JPH01244849A (ja) * | 1988-03-28 | 1989-09-29 | Matsushita Electric Works Ltd | 電気積層板の製造方法 |
JPH0397297A (ja) * | 1989-09-11 | 1991-04-23 | Toshiba Chem Corp | 多層銅張積層板およびその製造方法 |
JPH07109940B2 (ja) * | 1990-12-14 | 1995-11-22 | 松下電工株式会社 | 多層回路板の製造方法 |
JP2533689B2 (ja) * | 1990-12-14 | 1996-09-11 | 松下電工株式会社 | 多層回路板の製造方法 |
JP2841996B2 (ja) * | 1992-01-13 | 1998-12-24 | 日立化成工業株式会社 | リジッドフレックス配線板の製造方法 |
JP2001277273A (ja) * | 2000-03-29 | 2001-10-09 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
JP2010040592A (ja) * | 2008-07-31 | 2010-02-18 | Kyocer Slc Technologies Corp | 配線基板の製造方法 |
US9341415B2 (en) | 2008-12-17 | 2016-05-17 | Swep International Ab | Reinforced heat exchanger |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5418732B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-04-06 | 1979-07-10 | ||
JPS5516478B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-04-15 | 1980-05-02 | ||
JPS5439579B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-05-14 | 1979-11-28 | ||
JPS5155953A (ja) * | 1974-11-11 | 1976-05-17 | Hitachi Ltd | Kantsusetsuzokukonaiga juten sareta tasopurintokairobantosono seiho |
JPS5187770A (ja) * | 1975-01-31 | 1976-07-31 | Matsushita Electric Works Ltd | Tasopurintohaisenbanno seizoho |
-
1978
- 1978-06-16 JP JP7210178A patent/JPS54163359A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS54163359A (en) | 1979-12-25 |