JPS54163359A - Method of producing multiilayer printed circuit board - Google Patents

Method of producing multiilayer printed circuit board

Info

Publication number
JPS54163359A
JPS54163359A JP7210178A JP7210178A JPS54163359A JP S54163359 A JPS54163359 A JP S54163359A JP 7210178 A JP7210178 A JP 7210178A JP 7210178 A JP7210178 A JP 7210178A JP S54163359 A JPS54163359 A JP S54163359A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing
multiilayer printed
producing multiilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7210178A
Other languages
English (en)
Other versions
JPS6147000B2 (ja
Inventor
Takeshi Shimazaki
Motoyo Wajima
Akio Takahashi
Yasusada Morishita
Shiyuu Sugano
Hideki Asano
Yoshiyuki Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7210178A priority Critical patent/JPS54163359A/ja
Publication of JPS54163359A publication Critical patent/JPS54163359A/ja
Publication of JPS6147000B2 publication Critical patent/JPS6147000B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP7210178A 1978-06-16 1978-06-16 Method of producing multiilayer printed circuit board Granted JPS54163359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7210178A JPS54163359A (en) 1978-06-16 1978-06-16 Method of producing multiilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7210178A JPS54163359A (en) 1978-06-16 1978-06-16 Method of producing multiilayer printed circuit board

Publications (2)

Publication Number Publication Date
JPS54163359A true JPS54163359A (en) 1979-12-25
JPS6147000B2 JPS6147000B2 (ja) 1986-10-16

Family

ID=13479670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7210178A Granted JPS54163359A (en) 1978-06-16 1978-06-16 Method of producing multiilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS54163359A (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS58140193A (ja) * 1982-02-16 1983-08-19 富士通株式会社 高密度多層プリント板
JPS5948996A (ja) * 1982-09-13 1984-03-21 日本電気株式会社 多層プリント配線板およびその製造方法
JPS59187170U (ja) * 1983-05-30 1984-12-12 日本メクトロン株式会社 多層回路基板
JPS6390897A (ja) * 1986-10-03 1988-04-21 松下電工株式会社 多層配線板の製造方法
JPS644090A (en) * 1987-06-26 1989-01-09 Toshiba Chem Corp Multilayered copper-cladded laminate
JPS6480524A (en) * 1987-09-24 1989-03-27 Matsushita Electric Works Ltd Multi-layer printed wiring board
JPH01244849A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法
JPH0397297A (ja) * 1989-09-11 1991-04-23 Toshiba Chem Corp 多層銅張積層板およびその製造方法
JPH04215497A (ja) * 1990-12-14 1992-08-06 Matsushita Electric Works Ltd 多層回路板の製造方法
JPH04215496A (ja) * 1990-12-14 1992-08-06 Matsushita Electric Works Ltd 多層回路板の製造方法
JPH05191050A (ja) * 1992-01-13 1993-07-30 Hitachi Chem Co Ltd リジッドフレックス配線板の製造方法
JP2001277273A (ja) * 2000-03-29 2001-10-09 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2010040592A (ja) * 2008-07-31 2010-02-18 Kyocer Slc Technologies Corp 配線基板の製造方法
US9341415B2 (en) 2008-12-17 2016-05-17 Swep International Ab Reinforced heat exchanger

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125844A (ja) * 1973-04-06 1974-12-02
JPS50133457A (ja) * 1974-04-15 1975-10-22
JPS50145861A (ja) * 1974-05-14 1975-11-22
JPS5155953A (ja) * 1974-11-11 1976-05-17 Hitachi Ltd Kantsusetsuzokukonaiga juten sareta tasopurintokairobantosono seiho
JPS5187770A (ja) * 1975-01-31 1976-07-31 Matsushita Electric Works Ltd Tasopurintohaisenbanno seizoho

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125844A (ja) * 1973-04-06 1974-12-02
JPS50133457A (ja) * 1974-04-15 1975-10-22
JPS50145861A (ja) * 1974-05-14 1975-11-22
JPS5155953A (ja) * 1974-11-11 1976-05-17 Hitachi Ltd Kantsusetsuzokukonaiga juten sareta tasopurintokairobantosono seiho
JPS5187770A (ja) * 1975-01-31 1976-07-31 Matsushita Electric Works Ltd Tasopurintohaisenbanno seizoho

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS6225090B2 (ja) * 1980-06-23 1987-06-01 Furukawa Electric Co Ltd
JPS58140193A (ja) * 1982-02-16 1983-08-19 富士通株式会社 高密度多層プリント板
JPS5948996A (ja) * 1982-09-13 1984-03-21 日本電気株式会社 多層プリント配線板およびその製造方法
JPS6338878B2 (ja) * 1982-09-13 1988-08-02 Nippon Electric Co
JPS59187170U (ja) * 1983-05-30 1984-12-12 日本メクトロン株式会社 多層回路基板
JPS6390897A (ja) * 1986-10-03 1988-04-21 松下電工株式会社 多層配線板の製造方法
JPS644090A (en) * 1987-06-26 1989-01-09 Toshiba Chem Corp Multilayered copper-cladded laminate
JPS6480524A (en) * 1987-09-24 1989-03-27 Matsushita Electric Works Ltd Multi-layer printed wiring board
JPH0466180B2 (ja) * 1987-09-24 1992-10-22 Matsushita Electric Works Ltd
JPH01244849A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法
JPH0397297A (ja) * 1989-09-11 1991-04-23 Toshiba Chem Corp 多層銅張積層板およびその製造方法
JPH04215497A (ja) * 1990-12-14 1992-08-06 Matsushita Electric Works Ltd 多層回路板の製造方法
JPH04215496A (ja) * 1990-12-14 1992-08-06 Matsushita Electric Works Ltd 多層回路板の製造方法
JPH05191050A (ja) * 1992-01-13 1993-07-30 Hitachi Chem Co Ltd リジッドフレックス配線板の製造方法
JP2001277273A (ja) * 2000-03-29 2001-10-09 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2010040592A (ja) * 2008-07-31 2010-02-18 Kyocer Slc Technologies Corp 配線基板の製造方法
US9341415B2 (en) 2008-12-17 2016-05-17 Swep International Ab Reinforced heat exchanger

Also Published As

Publication number Publication date
JPS6147000B2 (ja) 1986-10-16

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