JPS54156167A - Method of producing double side printed circuit board - Google Patents

Method of producing double side printed circuit board

Info

Publication number
JPS54156167A
JPS54156167A JP6596678A JP6596678A JPS54156167A JP S54156167 A JPS54156167 A JP S54156167A JP 6596678 A JP6596678 A JP 6596678A JP 6596678 A JP6596678 A JP 6596678A JP S54156167 A JPS54156167 A JP S54156167A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
double side
side printed
producing double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6596678A
Other languages
Japanese (ja)
Inventor
Youichi Haruta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6596678A priority Critical patent/JPS54156167A/en
Publication of JPS54156167A publication Critical patent/JPS54156167A/en
Pending legal-status Critical Current

Links

JP6596678A 1978-05-31 1978-05-31 Method of producing double side printed circuit board Pending JPS54156167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6596678A JPS54156167A (en) 1978-05-31 1978-05-31 Method of producing double side printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6596678A JPS54156167A (en) 1978-05-31 1978-05-31 Method of producing double side printed circuit board

Publications (1)

Publication Number Publication Date
JPS54156167A true JPS54156167A (en) 1979-12-08

Family

ID=13302235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6596678A Pending JPS54156167A (en) 1978-05-31 1978-05-31 Method of producing double side printed circuit board

Country Status (1)

Country Link
JP (1) JPS54156167A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614295A (en) * 1984-06-19 1986-01-10 株式会社フジクラ Method of producing printed circuit board
JPS62158397A (en) * 1985-12-30 1987-07-14 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− Formation of conductive through-hole
JPS62290196A (en) * 1986-06-09 1987-12-17 松下電器産業株式会社 Formation of via-hole
JPH04247677A (en) * 1990-10-09 1992-09-03 Internatl Business Mach Corp <Ibm> Electrically/thermally interconnected circuit board and manufacture thereof
JP2012074724A (en) * 2007-07-19 2012-04-12 Advanced Optoelectronic Technology Inc Thin film substrate, package-encapsulated structure of compound semiconductor device having thin film substrate, and fabricating method thereof
WO2012161218A1 (en) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Wiring board and method for manufacturing wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056564A (en) * 1973-09-19 1975-05-17
JPS5085875A (en) * 1973-12-04 1975-07-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056564A (en) * 1973-09-19 1975-05-17
JPS5085875A (en) * 1973-12-04 1975-07-10

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614295A (en) * 1984-06-19 1986-01-10 株式会社フジクラ Method of producing printed circuit board
JPH0369192B2 (en) * 1984-06-19 1991-10-31 Fujikura Ltd
JPS62158397A (en) * 1985-12-30 1987-07-14 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− Formation of conductive through-hole
JPS62290196A (en) * 1986-06-09 1987-12-17 松下電器産業株式会社 Formation of via-hole
JPH04247677A (en) * 1990-10-09 1992-09-03 Internatl Business Mach Corp <Ibm> Electrically/thermally interconnected circuit board and manufacture thereof
JP2012074724A (en) * 2007-07-19 2012-04-12 Advanced Optoelectronic Technology Inc Thin film substrate, package-encapsulated structure of compound semiconductor device having thin film substrate, and fabricating method thereof
WO2012161218A1 (en) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Wiring board and method for manufacturing wiring board
CN103563495A (en) * 2011-05-26 2014-02-05 株式会社丰田自动织机 Wiring board and method for manufacturing wiring board
EP2717658A1 (en) * 2011-05-26 2014-04-09 Kabushiki Kaisha Toyota Jidoshokki Wiring board and method for manufacturing wiring board
TWI451817B (en) * 2011-05-26 2014-09-01 豐田自動織機股份有限公司 Wiring board and method of manufacturing the wiring board
JP5742936B2 (en) * 2011-05-26 2015-07-01 株式会社豊田自動織機 Wiring board and method of manufacturing wiring board
EP2717658A4 (en) * 2011-05-26 2015-08-12 Toyota Jidoshokki Kk Wiring board and method for manufacturing wiring board
US9332638B2 (en) 2011-05-26 2016-05-03 Kabushiki Kaisha Toyota Jidoshokki Wiring board and method for manufacturing wiring board

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