JPS6133258B2 - - Google Patents

Info

Publication number
JPS6133258B2
JPS6133258B2 JP52151973A JP15197377A JPS6133258B2 JP S6133258 B2 JPS6133258 B2 JP S6133258B2 JP 52151973 A JP52151973 A JP 52151973A JP 15197377 A JP15197377 A JP 15197377A JP S6133258 B2 JPS6133258 B2 JP S6133258B2
Authority
JP
Japan
Prior art keywords
film
present
leads
view
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52151973A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5483768A (en
Inventor
Kenji Tokuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15197377A priority Critical patent/JPS5483768A/ja
Publication of JPS5483768A publication Critical patent/JPS5483768A/ja
Publication of JPS6133258B2 publication Critical patent/JPS6133258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15197377A 1977-12-16 1977-12-16 Semiconductor device Granted JPS5483768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15197377A JPS5483768A (en) 1977-12-16 1977-12-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15197377A JPS5483768A (en) 1977-12-16 1977-12-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5483768A JPS5483768A (en) 1979-07-04
JPS6133258B2 true JPS6133258B2 (enrdf_load_stackoverflow) 1986-08-01

Family

ID=15530260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15197377A Granted JPS5483768A (en) 1977-12-16 1977-12-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5483768A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
US5463253A (en) * 1990-03-15 1995-10-31 Fujitsu Limited Semiconductor device having a plurality of chips
JPH061762U (ja) * 1992-06-08 1994-01-14 日野自動車工業株式会社 ディーゼルエンジンの排気ガス再循環装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN *

Also Published As

Publication number Publication date
JPS5483768A (en) 1979-07-04

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