JPS6131629B2 - - Google Patents

Info

Publication number
JPS6131629B2
JPS6131629B2 JP8015780A JP8015780A JPS6131629B2 JP S6131629 B2 JPS6131629 B2 JP S6131629B2 JP 8015780 A JP8015780 A JP 8015780A JP 8015780 A JP8015780 A JP 8015780A JP S6131629 B2 JPS6131629 B2 JP S6131629B2
Authority
JP
Japan
Prior art keywords
solder
electronic component
electronic components
lead frame
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8015780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS577145A (en
Inventor
Juji Miura
Minoru Kagino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP8015780A priority Critical patent/JPS577145A/ja
Publication of JPS577145A publication Critical patent/JPS577145A/ja
Publication of JPS6131629B2 publication Critical patent/JPS6131629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8015780A 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts Granted JPS577145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8015780A JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8015780A JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Publications (2)

Publication Number Publication Date
JPS577145A JPS577145A (en) 1982-01-14
JPS6131629B2 true JPS6131629B2 (de) 1986-07-21

Family

ID=13710459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8015780A Granted JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Country Status (1)

Country Link
JP (1) JPS577145A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169232U (de) * 1987-04-25 1988-11-04
JPH0520838U (ja) * 1991-08-29 1993-03-19 三菱自動車工業株式会社 位置決め固定装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225900Y2 (de) * 1981-03-18 1987-07-02
JPS58158992A (ja) * 1982-03-17 1983-09-21 株式会社日立製作所 半田処理方法
JPS58158993A (ja) * 1982-03-17 1983-09-21 株式会社日立製作所 電子部品の半田処理方法および装置
US7288472B2 (en) 2004-12-21 2007-10-30 Intel Corporation Method and system for performing die attach using a flame
CN112122889B (zh) * 2020-09-27 2021-11-19 西安远航真空钎焊技术有限公司 用于动力矢量喷管隔热板的制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169232U (de) * 1987-04-25 1988-11-04
JPH0520838U (ja) * 1991-08-29 1993-03-19 三菱自動車工業株式会社 位置決め固定装置

Also Published As

Publication number Publication date
JPS577145A (en) 1982-01-14

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