JPS6130740B2 - - Google Patents
Info
- Publication number
- JPS6130740B2 JPS6130740B2 JP11066978A JP11066978A JPS6130740B2 JP S6130740 B2 JPS6130740 B2 JP S6130740B2 JP 11066978 A JP11066978 A JP 11066978A JP 11066978 A JP11066978 A JP 11066978A JP S6130740 B2 JPS6130740 B2 JP S6130740B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor substrate
- state imaging
- solid
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 94
- 239000004065 semiconductor Substances 0.000 claims description 56
- 238000003384 imaging method Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000012546 transfer Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 18
- 238000001444 catalytic combustion detection Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000035945 sensitivity Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229940095676 wafer product Drugs 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003223 protective agent Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229960002050 hydrofluoric acid Drugs 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066978A JPS5538024A (en) | 1978-09-11 | 1978-09-11 | Manufacturing of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066978A JPS5538024A (en) | 1978-09-11 | 1978-09-11 | Manufacturing of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5538024A JPS5538024A (en) | 1980-03-17 |
| JPS6130740B2 true JPS6130740B2 (fr) | 1986-07-15 |
Family
ID=14541452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11066978A Granted JPS5538024A (en) | 1978-09-11 | 1978-09-11 | Manufacturing of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5538024A (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8803171D0 (en) * | 1988-02-11 | 1988-03-09 | English Electric Valve Co Ltd | Imaging apparatus |
| SG126885A1 (en) * | 2005-04-27 | 2006-11-29 | Disco Corp | Semiconductor wafer and processing method for same |
| JP4890206B2 (ja) | 2006-11-22 | 2012-03-07 | 日本精工株式会社 | ステアリング装置用締結部及びその製造方法 |
| JP5155030B2 (ja) * | 2008-06-13 | 2013-02-27 | 株式会社ディスコ | 光デバイスウエーハの分割方法 |
| JP5231136B2 (ja) * | 2008-08-22 | 2013-07-10 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
| JP5279775B2 (ja) * | 2010-08-25 | 2013-09-04 | 株式会社東芝 | 半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5348456A (en) * | 1976-10-14 | 1978-05-01 | Fujitsu Ltd | Dicing method of semiconductor substrate |
-
1978
- 1978-09-11 JP JP11066978A patent/JPS5538024A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5348456A (en) * | 1976-10-14 | 1978-05-01 | Fujitsu Ltd | Dicing method of semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5538024A (en) | 1980-03-17 |
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