JPS6128236B2 - - Google Patents
Info
- Publication number
- JPS6128236B2 JPS6128236B2 JP52023594A JP2359477A JPS6128236B2 JP S6128236 B2 JPS6128236 B2 JP S6128236B2 JP 52023594 A JP52023594 A JP 52023594A JP 2359477 A JP2359477 A JP 2359477A JP S6128236 B2 JPS6128236 B2 JP S6128236B2
- Authority
- JP
- Japan
- Prior art keywords
- polysilicon
- diode
- circuit
- junction
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P32/171—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/65—Integrated injection logic
-
- H10P32/1414—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/926—Elongated lead extending axially through another elongated lead
Landscapes
- Bipolar Integrated Circuits (AREA)
- Engineering & Computer Science (AREA)
- Logic Circuits (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2359477A JPS53108776A (en) | 1977-03-04 | 1977-03-04 | Semiconductor device |
| US05/882,766 US4227203A (en) | 1977-03-04 | 1978-03-02 | Semiconductor device having a polycrystalline silicon diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2359477A JPS53108776A (en) | 1977-03-04 | 1977-03-04 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53108776A JPS53108776A (en) | 1978-09-21 |
| JPS6128236B2 true JPS6128236B2 (cg-RX-API-DMAC10.html) | 1986-06-28 |
Family
ID=12114903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2359477A Granted JPS53108776A (en) | 1977-03-04 | 1977-03-04 | Semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4227203A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS53108776A (cg-RX-API-DMAC10.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54156489A (en) * | 1978-05-31 | 1979-12-10 | Oki Electric Ind Co Ltd | Semiconductor device and its manufacture |
| NL7806989A (nl) * | 1978-06-29 | 1980-01-03 | Philips Nv | Geintegreerde schakeling. |
| NL188721C (nl) * | 1978-12-22 | 1992-09-01 | Philips Nv | Halfgeleidergeheugenschakeling voor een statisch geheugen. |
| JPS55134962A (en) * | 1979-04-09 | 1980-10-21 | Toshiba Corp | Semiconductor device |
| JPS577959A (en) * | 1980-06-19 | 1982-01-16 | Toshiba Corp | Semiconductor device |
| JP3874919B2 (ja) * | 1998-02-27 | 2007-01-31 | 富士通株式会社 | 化合物半導体装置 |
| DE69926002T2 (de) * | 1999-11-17 | 2006-05-11 | Freescale Semiconductor, Inc., Austin | Herstellungsverfahren für eine Diode zur Integration mit einem Halbleiterbauelement und Herstellungsverfahren für ein Transistor-Bauelement mit einer integrierten Diode |
| US7244989B2 (en) * | 2005-06-02 | 2007-07-17 | Freescale Semiconductor, Inc. | Semiconductor device and method of manufacture |
| KR100699865B1 (ko) * | 2005-09-28 | 2007-03-28 | 삼성전자주식회사 | 화학기계적 연마를 이용한 자기 정렬 콘택 패드 형성 방법 |
| US9196753B2 (en) | 2011-04-19 | 2015-11-24 | Micron Technology, Inc. | Select devices including a semiconductive stack having a semiconductive material |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3443175A (en) * | 1967-03-22 | 1969-05-06 | Rca Corp | Pn-junction semiconductor with polycrystalline layer on one region |
| US3519901A (en) * | 1968-01-29 | 1970-07-07 | Texas Instruments Inc | Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation |
| US3648128A (en) * | 1968-05-25 | 1972-03-07 | Sony Corp | An integrated complementary transistor circuit chip with polycrystalline contact to buried collector regions |
| US3651385A (en) * | 1968-09-18 | 1972-03-21 | Sony Corp | Semiconductor device including a polycrystalline diode |
| US3904450A (en) * | 1974-04-26 | 1975-09-09 | Bell Telephone Labor Inc | Method of fabricating injection logic integrated circuits using oxide isolation |
-
1977
- 1977-03-04 JP JP2359477A patent/JPS53108776A/ja active Granted
-
1978
- 1978-03-02 US US05/882,766 patent/US4227203A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4227203A (en) | 1980-10-07 |
| JPS53108776A (en) | 1978-09-21 |
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