JPS6126282A - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPS6126282A
JPS6126282A JP14603584A JP14603584A JPS6126282A JP S6126282 A JPS6126282 A JP S6126282A JP 14603584 A JP14603584 A JP 14603584A JP 14603584 A JP14603584 A JP 14603584A JP S6126282 A JPS6126282 A JP S6126282A
Authority
JP
Japan
Prior art keywords
layer
cutting
thin film
thickness
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14603584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563955B2 (enrdf_load_stackoverflow
Inventor
金原　広治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP14603584A priority Critical patent/JPS6126282A/ja
Priority to FR858510660A priority patent/FR2567709B1/fr
Publication of JPS6126282A publication Critical patent/JPS6126282A/ja
Priority to FR8615585A priority patent/FR2590105A1/fr
Priority to US07/115,565 priority patent/US4840924A/en
Publication of JPH0563955B2 publication Critical patent/JPH0563955B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP14603584A 1984-07-11 1984-07-16 多層配線基板 Granted JPS6126282A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP14603584A JPS6126282A (ja) 1984-07-16 1984-07-16 多層配線基板
FR858510660A FR2567709B1 (fr) 1984-07-11 1985-07-11 Ensemble a paillette comprenant un substrat de cablage multi-couche
FR8615585A FR2590105A1 (fr) 1984-07-11 1986-11-07 Ensemble a paillette comprenant un substrat de cablage multicouche
US07/115,565 US4840924A (en) 1984-07-11 1987-10-29 Method of fabricating a multichip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14603584A JPS6126282A (ja) 1984-07-16 1984-07-16 多層配線基板

Publications (2)

Publication Number Publication Date
JPS6126282A true JPS6126282A (ja) 1986-02-05
JPH0563955B2 JPH0563955B2 (enrdf_load_stackoverflow) 1993-09-13

Family

ID=15398632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14603584A Granted JPS6126282A (ja) 1984-07-11 1984-07-16 多層配線基板

Country Status (1)

Country Link
JP (1) JPS6126282A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239596A (ja) * 1986-04-11 1987-10-20 株式会社日立製作所 配線基板
JPH02341A (ja) * 1987-02-02 1990-01-05 Seiko Epson Corp 半導体装置及びその製造方法
JP2008027604A (ja) * 2006-07-18 2008-02-07 Yazaki Corp コネクタ及びコネクタユニット
JP2010238755A (ja) * 2009-03-30 2010-10-21 Murata Mfg Co Ltd ランド構造

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427956A (en) * 1977-08-01 1979-03-02 Nippon Electric Co Method of making thick film integrated circuit
JPS56104166U (enrdf_load_stackoverflow) * 1980-01-10 1981-08-14
JPS5759473U (enrdf_load_stackoverflow) * 1980-09-26 1982-04-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427956A (en) * 1977-08-01 1979-03-02 Nippon Electric Co Method of making thick film integrated circuit
JPS56104166U (enrdf_load_stackoverflow) * 1980-01-10 1981-08-14
JPS5759473U (enrdf_load_stackoverflow) * 1980-09-26 1982-04-08

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239596A (ja) * 1986-04-11 1987-10-20 株式会社日立製作所 配線基板
JPH02341A (ja) * 1987-02-02 1990-01-05 Seiko Epson Corp 半導体装置及びその製造方法
JP2008027604A (ja) * 2006-07-18 2008-02-07 Yazaki Corp コネクタ及びコネクタユニット
JP2010238755A (ja) * 2009-03-30 2010-10-21 Murata Mfg Co Ltd ランド構造

Also Published As

Publication number Publication date
JPH0563955B2 (enrdf_load_stackoverflow) 1993-09-13

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Legal Events

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