JPS6126220B2 - - Google Patents
Info
- Publication number
- JPS6126220B2 JPS6126220B2 JP52153939A JP15393977A JPS6126220B2 JP S6126220 B2 JPS6126220 B2 JP S6126220B2 JP 52153939 A JP52153939 A JP 52153939A JP 15393977 A JP15393977 A JP 15393977A JP S6126220 B2 JPS6126220 B2 JP S6126220B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- hardness
- copper foil
- frame material
- rolled copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 241000239290 Araneae Species 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393977A JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393977A JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5485672A JPS5485672A (en) | 1979-07-07 |
| JPS6126220B2 true JPS6126220B2 (da) | 1986-06-19 |
Family
ID=15573374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15393977A Granted JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5485672A (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387725U (da) * | 1986-11-27 | 1988-06-08 |
-
1977
- 1977-12-20 JP JP15393977A patent/JPS5485672A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387725U (da) * | 1986-11-27 | 1988-06-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5485672A (en) | 1979-07-07 |
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