JPS6125539B2 - - Google Patents
Info
- Publication number
- JPS6125539B2 JPS6125539B2 JP6798777A JP6798777A JPS6125539B2 JP S6125539 B2 JPS6125539 B2 JP S6125539B2 JP 6798777 A JP6798777 A JP 6798777A JP 6798777 A JP6798777 A JP 6798777A JP S6125539 B2 JPS6125539 B2 JP S6125539B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- base material
- metal foil
- adhesive layer
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000004744 fabric Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 239000002759 woven fabric Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims description 3
- 238000005470 impregnation Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000009816 wet lamination Methods 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6798777A JPS544370A (en) | 1977-06-10 | 1977-06-10 | Base plate for flexible print wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6798777A JPS544370A (en) | 1977-06-10 | 1977-06-10 | Base plate for flexible print wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS544370A JPS544370A (en) | 1979-01-13 |
| JPS6125539B2 true JPS6125539B2 (enExample) | 1986-06-16 |
Family
ID=13360827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6798777A Granted JPS544370A (en) | 1977-06-10 | 1977-06-10 | Base plate for flexible print wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS544370A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148487A (en) * | 1979-05-08 | 1980-11-19 | Hitachi Chemical Co Ltd | Method of fabricating flexible printed circuit board |
| JPS60132328U (ja) * | 1984-02-13 | 1985-09-04 | 西川 幸雄 | 断熱シ−ト |
| JPS627190A (ja) * | 1985-07-03 | 1987-01-14 | ニツカン工業株式会社 | フレキシブル配線用基板およびその製造方法 |
| JPS63254032A (ja) * | 1987-04-10 | 1988-10-20 | 三井金属鉱業株式会社 | セラミツク配線基板用材料およびその製造法 |
| JP2014204029A (ja) * | 2013-04-08 | 2014-10-27 | 立山科学工業株式会社 | Ｌｅｄ実装用基板 |
-
1977
- 1977-06-10 JP JP6798777A patent/JPS544370A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS544370A (en) | 1979-01-13 |
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