JPS6120629B2 - - Google Patents
Info
- Publication number
- JPS6120629B2 JPS6120629B2 JP7716179A JP7716179A JPS6120629B2 JP S6120629 B2 JPS6120629 B2 JP S6120629B2 JP 7716179 A JP7716179 A JP 7716179A JP 7716179 A JP7716179 A JP 7716179A JP S6120629 B2 JPS6120629 B2 JP S6120629B2
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- ions
- tank
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 174
- 239000010949 copper Substances 0.000 claims description 61
- 239000000126 substance Substances 0.000 claims description 58
- 229910052802 copper Inorganic materials 0.000 claims description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 39
- 229910001431 copper ion Inorganic materials 0.000 claims description 39
- 238000000909 electrodialysis Methods 0.000 claims description 37
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 27
- 239000012528 membrane Substances 0.000 claims description 15
- 239000003638 chemical reducing agent Substances 0.000 claims description 13
- 150000002500 ions Chemical class 0.000 claims description 13
- 239000002738 chelating agent Substances 0.000 claims description 10
- 238000000502 dialysis Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000001172 regenerating effect Effects 0.000 claims description 10
- 230000008929 regeneration Effects 0.000 claims description 9
- 238000011069 regeneration method Methods 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 7
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 6
- 150000001450 anions Chemical class 0.000 claims description 5
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003957 anion exchange resin Substances 0.000 claims description 4
- 239000003729 cation exchange resin Substances 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 2
- 239000003002 pH adjusting agent Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 description 98
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- -1 formate ions Chemical class 0.000 description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 229910001415 sodium ion Inorganic materials 0.000 description 7
- 239000003011 anion exchange membrane Substances 0.000 description 5
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 238000005341 cation exchange Methods 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000010979 pH adjustment Methods 0.000 description 4
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 4
- 235000019254 sodium formate Nutrition 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 229960003330 pentetic acid Drugs 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N Glycolaldehyde Chemical compound OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNMCCPMYXUKHAZ-UHFFFAOYSA-N 2-[3,3-diamino-1,2,2-tris(carboxymethyl)cyclohexyl]acetic acid Chemical compound NC1(N)CCCC(CC(O)=O)(CC(O)=O)C1(CC(O)=O)CC(O)=O RNMCCPMYXUKHAZ-UHFFFAOYSA-N 0.000 description 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005115 demineralization Methods 0.000 description 1
- 230000002328 demineralizing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 229940042400 direct acting antivirals phosphonic acid derivative Drugs 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- IYRGXJIJGHOCFS-UHFFFAOYSA-N neocuproine Chemical compound C1=C(C)N=C2C3=NC(C)=CC=C3C=CC2=C1 IYRGXJIJGHOCFS-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003007 phosphonic acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- USIPWJRLUGPSJM-UHFFFAOYSA-K trisodium 2-(2-aminoethylamino)ethanol triacetate Chemical compound [Na+].[Na+].[Na+].CC([O-])=O.CC([O-])=O.CC([O-])=O.NCCNCCO USIPWJRLUGPSJM-UHFFFAOYSA-K 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
US06/160,201 US4324629A (en) | 1979-06-19 | 1980-06-17 | Process for regenerating chemical copper plating solution |
DE3022962A DE3022962C2 (de) | 1979-06-19 | 1980-06-19 | Verfahren zum Regenerieren einer chemischen Verkupferungslösung |
NLAANVRAGE8003553,A NL188683C (nl) | 1979-06-19 | 1980-06-19 | Werkwijze voor het regenereren van een bad voor het chemisch verkoperen. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS563666A JPS563666A (en) | 1981-01-14 |
JPS6120629B2 true JPS6120629B2 (enrdf_load_stackoverflow) | 1986-05-23 |
Family
ID=13626059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7716179A Granted JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS563666A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0015737B1 (en) * | 1979-03-05 | 1983-05-11 | Electrochem International, Inc. | Process for the regeneration of electroless plating baths |
JPS57200549A (en) * | 1981-06-05 | 1982-12-08 | Hitachi Ltd | Continuous regeneration of chemical copper plating liquid |
JPS57197764U (enrdf_load_stackoverflow) * | 1981-06-09 | 1982-12-15 | ||
JPS5811775A (ja) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | 銅の化学メッキ廃液の再生方法 |
JPS61235567A (ja) * | 1985-04-10 | 1986-10-20 | Chuo Seisakusho:Kk | めっき液の濾過装置 |
EP1726683B1 (de) | 2005-05-25 | 2008-04-09 | Enthone Inc. | Verfahren und Vorrichtung zur Einstellung der Ionenkonzentration in Elektrolyten |
-
1979
- 1979-06-19 JP JP7716179A patent/JPS563666A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS563666A (en) | 1981-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000355774A (ja) | めっき方法とそれに用いるめっき液前駆体 | |
EP0132594A1 (en) | Electroless copper plating solution | |
DE3022962A1 (de) | Verfahren zum regenerieren einer chemischen verkupferungsloesung | |
KR20150024326A (ko) | 도금 조성물을 재생하기 위한 방법 및 재생 장치 | |
JPS6120629B2 (enrdf_load_stackoverflow) | ||
JP4799260B2 (ja) | 無電解ニッケルめっき液の長寿命化装置 | |
EP1420891B1 (en) | Electroless nickel plating solution and process for its use | |
US6245389B1 (en) | Method for circulating electroless nickel plating solution | |
CA1266401A (en) | Copper bath for electroless plating having excess counter-cation and process using same | |
JP2000503354A (ja) | 無電解ニッケルめっき浴からのオルト亜燐酸塩イオンの除去 | |
EP0015737A1 (en) | Process for the regeneration of electroless plating baths | |
JPS6411716B2 (enrdf_load_stackoverflow) | ||
JP3162243B2 (ja) | 無電解めっき方法 | |
EP0693577B1 (en) | Nickel hypophosphite manufacture | |
TW202428933A (zh) | 鍍敷組合物之再生方法及再生裝置 | |
CH633585A5 (de) | Verfahren zum betrieb von ohne aeussere stromquelle arbeitenden verkupferungsbaedern. | |
US5944879A (en) | Nickel hypophosphite solutions containing increased nickel concentration | |
JPS61194182A (ja) | 無電解めつき浴の連続再生方法及びその装置 | |
US6391177B1 (en) | High temperature continuous electrodialysis of electroless plating solutions | |
JPS602669A (ja) | 無電解めっき液の管理装置 | |
JPS5854200B2 (ja) | 電気メツキ浴における金属イオンの供給方法 | |
US2817628A (en) | Antimony plating bath | |
CA1050865A (en) | Alkaline compositions and process for etching copper | |
US8057678B2 (en) | Maintenance of metallization baths | |
JPS6112871A (ja) | 無電解銅めつき液の連続的再生方法 |