JPS563666A - Method and apparatus for regenerating chemical copper plating solution - Google Patents
Method and apparatus for regenerating chemical copper plating solutionInfo
- Publication number
- JPS563666A JPS563666A JP7716179A JP7716179A JPS563666A JP S563666 A JPS563666 A JP S563666A JP 7716179 A JP7716179 A JP 7716179A JP 7716179 A JP7716179 A JP 7716179A JP S563666 A JPS563666 A JP S563666A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- exchange membranes
- plating
- solns
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 230000001172 regenerating effect Effects 0.000 title 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000003011 anion exchange membrane Substances 0.000 abstract 2
- 238000005341 cation exchange Methods 0.000 abstract 2
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 235000011121 sodium hydroxide Nutrition 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
| US06/160,201 US4324629A (en) | 1979-06-19 | 1980-06-17 | Process for regenerating chemical copper plating solution |
| DE3022962A DE3022962C2 (de) | 1979-06-19 | 1980-06-19 | Verfahren zum Regenerieren einer chemischen Verkupferungslösung |
| NLAANVRAGE8003553,A NL188683C (nl) | 1979-06-19 | 1980-06-19 | Werkwijze voor het regenereren van een bad voor het chemisch verkoperen. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS563666A true JPS563666A (en) | 1981-01-14 |
| JPS6120629B2 JPS6120629B2 (enrdf_load_stackoverflow) | 1986-05-23 |
Family
ID=13626059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7716179A Granted JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS563666A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56108868A (en) * | 1979-03-05 | 1981-08-28 | Electrochem Int Inc | Regeneration of electroless plating electrodialitically by removing at least part of reaction product |
| JPS57200549A (en) * | 1981-06-05 | 1982-12-08 | Hitachi Ltd | Continuous regeneration of chemical copper plating liquid |
| JPS57197764U (enrdf_load_stackoverflow) * | 1981-06-09 | 1982-12-15 | ||
| JPS5811775A (ja) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | 銅の化学メッキ廃液の再生方法 |
| JPS61235567A (ja) * | 1985-04-10 | 1986-10-20 | Chuo Seisakusho:Kk | めっき液の濾過装置 |
| US7846316B2 (en) | 2005-05-25 | 2010-12-07 | Enthone Inc. | Method for supplying a plating composition with deposition metal ion during a plating operation |
-
1979
- 1979-06-19 JP JP7716179A patent/JPS563666A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56108868A (en) * | 1979-03-05 | 1981-08-28 | Electrochem Int Inc | Regeneration of electroless plating electrodialitically by removing at least part of reaction product |
| JPS57200549A (en) * | 1981-06-05 | 1982-12-08 | Hitachi Ltd | Continuous regeneration of chemical copper plating liquid |
| JPS57197764U (enrdf_load_stackoverflow) * | 1981-06-09 | 1982-12-15 | ||
| JPS5811775A (ja) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | 銅の化学メッキ廃液の再生方法 |
| JPS61235567A (ja) * | 1985-04-10 | 1986-10-20 | Chuo Seisakusho:Kk | めっき液の濾過装置 |
| US7846316B2 (en) | 2005-05-25 | 2010-12-07 | Enthone Inc. | Method for supplying a plating composition with deposition metal ion during a plating operation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120629B2 (enrdf_load_stackoverflow) | 1986-05-23 |
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