JPS563666A - Method and apparatus for regenerating chemical copper plating solution - Google Patents
Method and apparatus for regenerating chemical copper plating solutionInfo
- Publication number
- JPS563666A JPS563666A JP7716179A JP7716179A JPS563666A JP S563666 A JPS563666 A JP S563666A JP 7716179 A JP7716179 A JP 7716179A JP 7716179 A JP7716179 A JP 7716179A JP S563666 A JPS563666 A JP S563666A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- exchange membranes
- plating
- solns
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To remove only reaction inhibitive components contained in a chemical copper plating soln., by using an electrodialyzer equipped with cation exchange membranes and/or anion exchange membranes.
CONSTITUTION: After continuous use of a chemical copper plating soln., SO4 2- formed from copper sulfate added for replenishing copper ions, HCOO- formed from formaldehyde used as a reducing agent for copper ions, Na+ formed from caustic soda which keeps the plating soln. alkaline, and CO3 2- formed from absorbed CO2, accumulate in the plating soln. and inhibit the reaction. To remove these components, the solns. contained respectively in a plating tank 1, an electrode soln. tank 10, and a concd. soln. tank 14 are delivered by circulating pumps 5, 11, 15 while being kept at 0.05atm to an electrodialyzer 9 which is equipped with eleven cation exchange membranes facing to the cathode, and with eleven anion exchange membranes facing to the anode, hereby these solns. are dialyzed, and one or more reaction-inhibitive components are removed selectively from these solns., hence the plating soln. is regenerated.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
US06/160,201 US4324629A (en) | 1979-06-19 | 1980-06-17 | Process for regenerating chemical copper plating solution |
DE3022962A DE3022962C2 (en) | 1979-06-19 | 1980-06-19 | Process for regenerating a chemical copper plating solution |
NLAANVRAGE8003553,A NL188683C (en) | 1979-06-19 | 1980-06-19 | METHOD FOR REGENERATING A BATH FOR CHEMICAL COPYING. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7716179A JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS563666A true JPS563666A (en) | 1981-01-14 |
JPS6120629B2 JPS6120629B2 (en) | 1986-05-23 |
Family
ID=13626059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7716179A Granted JPS563666A (en) | 1979-06-19 | 1979-06-19 | Method and apparatus for regenerating chemical copper plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS563666A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56108868A (en) * | 1979-03-05 | 1981-08-28 | Electrochem Int Inc | Regeneration of electroless plating electrodialitically by removing at least part of reaction product |
JPS57200549A (en) * | 1981-06-05 | 1982-12-08 | Hitachi Ltd | Continuous regeneration of chemical copper plating liquid |
JPS57197764U (en) * | 1981-06-09 | 1982-12-15 | ||
JPS5811775A (en) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | Treatment method of chemical plating waste liquor of copper |
JPS61235567A (en) * | 1985-04-10 | 1986-10-20 | Chuo Seisakusho:Kk | Method and apparatus for filtering plating liquid |
US7846316B2 (en) | 2005-05-25 | 2010-12-07 | Enthone Inc. | Method for supplying a plating composition with deposition metal ion during a plating operation |
-
1979
- 1979-06-19 JP JP7716179A patent/JPS563666A/en active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56108868A (en) * | 1979-03-05 | 1981-08-28 | Electrochem Int Inc | Regeneration of electroless plating electrodialitically by removing at least part of reaction product |
JPH0416549B2 (en) * | 1979-03-05 | 1992-03-24 | Electrochem Int Inc | |
JPS57200549A (en) * | 1981-06-05 | 1982-12-08 | Hitachi Ltd | Continuous regeneration of chemical copper plating liquid |
JPS6341983B2 (en) * | 1981-06-05 | 1988-08-19 | Hitachi Ltd | |
JPS57197764U (en) * | 1981-06-09 | 1982-12-15 | ||
JPS5811775A (en) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | Treatment method of chemical plating waste liquor of copper |
JPS61235567A (en) * | 1985-04-10 | 1986-10-20 | Chuo Seisakusho:Kk | Method and apparatus for filtering plating liquid |
JPH0475315B2 (en) * | 1985-04-10 | 1992-11-30 | ||
US7846316B2 (en) | 2005-05-25 | 2010-12-07 | Enthone Inc. | Method for supplying a plating composition with deposition metal ion during a plating operation |
Also Published As
Publication number | Publication date |
---|---|
JPS6120629B2 (en) | 1986-05-23 |
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