JPS61192334A - 真空処理装置 - Google Patents

真空処理装置

Info

Publication number
JPS61192334A
JPS61192334A JP3279985A JP3279985A JPS61192334A JP S61192334 A JPS61192334 A JP S61192334A JP 3279985 A JP3279985 A JP 3279985A JP 3279985 A JP3279985 A JP 3279985A JP S61192334 A JPS61192334 A JP S61192334A
Authority
JP
Japan
Prior art keywords
substrate
chamber
holder assembly
drum jig
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3279985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0480734B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Haruo Sugiyama
春男 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP3279985A priority Critical patent/JPS61192334A/ja
Publication of JPS61192334A publication Critical patent/JPS61192334A/ja
Publication of JPH0480734B2 publication Critical patent/JPH0480734B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP3279985A 1985-02-22 1985-02-22 真空処理装置 Granted JPS61192334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3279985A JPS61192334A (ja) 1985-02-22 1985-02-22 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3279985A JPS61192334A (ja) 1985-02-22 1985-02-22 真空処理装置

Publications (2)

Publication Number Publication Date
JPS61192334A true JPS61192334A (ja) 1986-08-26
JPH0480734B2 JPH0480734B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-21

Family

ID=12368890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3279985A Granted JPS61192334A (ja) 1985-02-22 1985-02-22 真空処理装置

Country Status (1)

Country Link
JP (1) JPS61192334A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099948A (ja) * 2002-09-06 2004-04-02 Shincron:Kk 薄膜形成装置
JP2004099947A (ja) * 2002-09-06 2004-04-02 Shincron:Kk 薄膜形成装置
US20110253523A1 (en) * 2010-04-16 2011-10-20 Hon Hai Precision Industry Co., Ltd. Sputtering apparatus and method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200532043A (en) * 2004-02-10 2005-10-01 Ulvac Inc Thin film forming apparatus
JP2014003147A (ja) * 2012-06-18 2014-01-09 Ulvac Japan Ltd ドライエッチング装置
JP7317906B2 (ja) * 2021-09-02 2023-07-31 キヤノンアネルバ株式会社 真空処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099948A (ja) * 2002-09-06 2004-04-02 Shincron:Kk 薄膜形成装置
JP2004099947A (ja) * 2002-09-06 2004-04-02 Shincron:Kk 薄膜形成装置
US20110253523A1 (en) * 2010-04-16 2011-10-20 Hon Hai Precision Industry Co., Ltd. Sputtering apparatus and method

Also Published As

Publication number Publication date
JPH0480734B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-21

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