JPS6119106B2 - - Google Patents
Info
- Publication number
- JPS6119106B2 JPS6119106B2 JP6678579A JP6678579A JPS6119106B2 JP S6119106 B2 JPS6119106 B2 JP S6119106B2 JP 6678579 A JP6678579 A JP 6678579A JP 6678579 A JP6678579 A JP 6678579A JP S6119106 B2 JPS6119106 B2 JP S6119106B2
- Authority
- JP
- Japan
- Prior art keywords
- piece
- lower piece
- electrode
- main surface
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 9
- 239000004917 carbon fiber Substances 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 229920003002 synthetic resin Polymers 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6678579A JPS55160437A (en) | 1979-05-31 | 1979-05-31 | Semiconductor device |
US06/154,470 US4403242A (en) | 1979-05-31 | 1980-05-29 | Semiconductor device having a metal-fiber composite material electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6678579A JPS55160437A (en) | 1979-05-31 | 1979-05-31 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55160437A JPS55160437A (en) | 1980-12-13 |
JPS6119106B2 true JPS6119106B2 (US20050075337A1-20050407-C00081.png) | 1986-05-15 |
Family
ID=13325856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6678579A Granted JPS55160437A (en) | 1979-05-31 | 1979-05-31 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
US (1) | US4403242A (US20050075337A1-20050407-C00081.png) |
JP (1) | JPS55160437A (US20050075337A1-20050407-C00081.png) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56131955A (en) * | 1980-09-01 | 1981-10-15 | Hitachi Ltd | Semiconductor device |
US4517585A (en) * | 1982-08-13 | 1985-05-14 | Lucas Chloride Ev Systems Limited | Heat sink for semi-conductor devices having terminals projecting from a heat sink transfer face |
US4614964A (en) * | 1984-08-15 | 1986-09-30 | Sundstrand Corporation | Coaxial semiconductor package |
US4953003A (en) * | 1987-05-21 | 1990-08-28 | Siemens Aktiengesellschaft | Power semiconductor device |
JP2714115B2 (ja) * | 1988-03-31 | 1998-02-16 | 株式会社東芝 | 電力用半導体スイッチ装置 |
DE59407080D1 (de) * | 1993-08-09 | 1998-11-19 | Siemens Ag | Leistungs-Halbleiterbauelement mit Druckkontakt |
EP1403923A1 (en) * | 2002-09-27 | 2004-03-31 | Abb Research Ltd. | Press pack power semiconductor module |
DE102007041124B4 (de) * | 2007-08-30 | 2009-06-04 | Infineon Technologies Ag | Thyristor mit verbessertem Einschaltverhalten, Thyristoranordnung mit einem Thyristor, Verfahren zur Herstellung eines Thyristors und einer Thyristoranordnung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3519896A (en) * | 1969-03-11 | 1970-07-07 | Motorola Inc | Power transistor assembly |
US3654529A (en) * | 1971-04-05 | 1972-04-04 | Gen Electric | Loose contact press pack |
JPS5116302B2 (US20050075337A1-20050407-C00081.png) * | 1973-10-22 | 1976-05-22 | ||
DE2525390A1 (de) * | 1975-06-06 | 1976-12-16 | Siemens Ag | Steuerbares halbleiterbauelement |
NL7604951A (nl) * | 1976-05-10 | 1977-11-14 | Philips Nv | Glas voor het passiveren van halfgeleider- inrichtingen. |
JPS603776B2 (ja) * | 1977-06-03 | 1985-01-30 | 株式会社日立製作所 | 半導体素子 |
-
1979
- 1979-05-31 JP JP6678579A patent/JPS55160437A/ja active Granted
-
1980
- 1980-05-29 US US06/154,470 patent/US4403242A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4403242A (en) | 1983-09-06 |
JPS55160437A (en) | 1980-12-13 |
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