JPS61179545A - 半導体装置用配線基板の製造方法 - Google Patents

半導体装置用配線基板の製造方法

Info

Publication number
JPS61179545A
JPS61179545A JP59190959A JP19095984A JPS61179545A JP S61179545 A JPS61179545 A JP S61179545A JP 59190959 A JP59190959 A JP 59190959A JP 19095984 A JP19095984 A JP 19095984A JP S61179545 A JPS61179545 A JP S61179545A
Authority
JP
Japan
Prior art keywords
layer
dam
resist
resist layer
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59190959A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342498B2 (enExample
Inventor
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP59190959A priority Critical patent/JPS61179545A/ja
Publication of JPS61179545A publication Critical patent/JPS61179545A/ja
Publication of JPH0342498B2 publication Critical patent/JPH0342498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP59190959A 1984-09-12 1984-09-12 半導体装置用配線基板の製造方法 Granted JPS61179545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59190959A JPS61179545A (ja) 1984-09-12 1984-09-12 半導体装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59190959A JPS61179545A (ja) 1984-09-12 1984-09-12 半導体装置用配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61179545A true JPS61179545A (ja) 1986-08-12
JPH0342498B2 JPH0342498B2 (enExample) 1991-06-27

Family

ID=16266519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59190959A Granted JPS61179545A (ja) 1984-09-12 1984-09-12 半導体装置用配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61179545A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283843A (ja) * 1988-05-10 1989-11-15 Nec Corp 電子機器装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283843A (ja) * 1988-05-10 1989-11-15 Nec Corp 電子機器装置

Also Published As

Publication number Publication date
JPH0342498B2 (enExample) 1991-06-27

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