JPS61174796A - 多層回路板の製造法 - Google Patents
多層回路板の製造法Info
- Publication number
- JPS61174796A JPS61174796A JP1607985A JP1607985A JPS61174796A JP S61174796 A JPS61174796 A JP S61174796A JP 1607985 A JP1607985 A JP 1607985A JP 1607985 A JP1607985 A JP 1607985A JP S61174796 A JPS61174796 A JP S61174796A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- punching
- manufacturing
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 description 15
- 238000007747 plating Methods 0.000 description 12
- 238000005553 drilling Methods 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000997 High-speed steel Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1607985A JPS61174796A (ja) | 1985-01-30 | 1985-01-30 | 多層回路板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1607985A JPS61174796A (ja) | 1985-01-30 | 1985-01-30 | 多層回路板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61174796A true JPS61174796A (ja) | 1986-08-06 |
| JPH0240234B2 JPH0240234B2 (enrdf_load_stackoverflow) | 1990-09-10 |
Family
ID=11906546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1607985A Granted JPS61174796A (ja) | 1985-01-30 | 1985-01-30 | 多層回路板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174796A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177498A (ja) * | 1988-12-28 | 1990-07-10 | Shin Kobe Electric Mach Co Ltd | 多層印刷配線板 |
| JPH04215497A (ja) * | 1990-12-14 | 1992-08-06 | Matsushita Electric Works Ltd | 多層回路板の製造方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521204A (en) * | 1978-08-01 | 1980-02-15 | Sumitomo Bakelite Co | Thermal hardening resin laminated structure and its preparation |
| JPS56165397A (en) * | 1980-05-24 | 1981-12-18 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed board |
| JPS5719587A (en) * | 1980-07-09 | 1982-02-01 | Shinagawa Refractories Co | Protection of metalic structure in ceramic kiln |
| JPS5751998A (en) * | 1980-07-08 | 1982-03-27 | Mannesmann Ag | Apparatus for regulating axial compressor |
| JPS5823498A (ja) * | 1981-08-04 | 1983-02-12 | 三菱瓦斯化学株式会社 | ガラス織布基材 |
| JPS58115880A (ja) * | 1981-12-28 | 1983-07-09 | 三菱瓦斯化学株式会社 | ガラス織布基材 |
| JPS5974698A (ja) * | 1982-10-21 | 1984-04-27 | 日立化成工業株式会社 | ３層印刷配線板の製造法 |
| JPS61117883A (ja) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | 多層印刷配線板用基板 |
-
1985
- 1985-01-30 JP JP1607985A patent/JPS61174796A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521204A (en) * | 1978-08-01 | 1980-02-15 | Sumitomo Bakelite Co | Thermal hardening resin laminated structure and its preparation |
| JPS56165397A (en) * | 1980-05-24 | 1981-12-18 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed board |
| JPS5751998A (en) * | 1980-07-08 | 1982-03-27 | Mannesmann Ag | Apparatus for regulating axial compressor |
| JPS5719587A (en) * | 1980-07-09 | 1982-02-01 | Shinagawa Refractories Co | Protection of metalic structure in ceramic kiln |
| JPS5823498A (ja) * | 1981-08-04 | 1983-02-12 | 三菱瓦斯化学株式会社 | ガラス織布基材 |
| JPS58115880A (ja) * | 1981-12-28 | 1983-07-09 | 三菱瓦斯化学株式会社 | ガラス織布基材 |
| JPS5974698A (ja) * | 1982-10-21 | 1984-04-27 | 日立化成工業株式会社 | ３層印刷配線板の製造法 |
| JPS61117883A (ja) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | 多層印刷配線板用基板 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177498A (ja) * | 1988-12-28 | 1990-07-10 | Shin Kobe Electric Mach Co Ltd | 多層印刷配線板 |
| JPH04215497A (ja) * | 1990-12-14 | 1992-08-06 | Matsushita Electric Works Ltd | 多層回路板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0240234B2 (enrdf_load_stackoverflow) | 1990-09-10 |
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