JPS61174734A - 基体吸着法 - Google Patents
基体吸着法Info
- Publication number
- JPS61174734A JPS61174734A JP60015797A JP1579785A JPS61174734A JP S61174734 A JPS61174734 A JP S61174734A JP 60015797 A JP60015797 A JP 60015797A JP 1579785 A JP1579785 A JP 1579785A JP S61174734 A JPS61174734 A JP S61174734A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- adsorption
- adsorption method
- section
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 176
- 238000000034 method Methods 0.000 title claims description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000001179 sorption measurement Methods 0.000 claims description 113
- 238000009434 installation Methods 0.000 claims description 61
- 239000011521 glass Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 150000002739 metals Chemical class 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 10
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 9
- -1 aluminoborosilicate Chemical compound 0.000 claims description 9
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 claims description 9
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 150000001247 metal acetylides Chemical class 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 229910003437 indium oxide Inorganic materials 0.000 claims 8
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 8
- 229910052750 molybdenum Inorganic materials 0.000 claims 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 4
- 229910001887 tin oxide Inorganic materials 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 abstract 3
- 239000011651 chromium Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 241000511976 Hoya Species 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015797A JPS61174734A (ja) | 1985-01-30 | 1985-01-30 | 基体吸着法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015797A JPS61174734A (ja) | 1985-01-30 | 1985-01-30 | 基体吸着法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61174734A true JPS61174734A (ja) | 1986-08-06 |
| JPH0152898B2 JPH0152898B2 (enExample) | 1989-11-10 |
Family
ID=11898828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60015797A Granted JPS61174734A (ja) | 1985-01-30 | 1985-01-30 | 基体吸着法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174734A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040577A (ja) * | 2008-07-31 | 2010-02-18 | Nikon Corp | 露光方法、デバイスの製造方法及び露光装置 |
| CN110919420A (zh) * | 2019-11-26 | 2020-03-27 | 芜湖诚拓汽车部件股份有限公司 | 汽车铸造件自动化生产铸件加工夹持工装 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5898941A (ja) * | 1981-11-30 | 1983-06-13 | テンコ−・インストルメンツ | ウエ−ハ・チヤツク |
| JPS5946030A (ja) * | 1982-09-08 | 1984-03-15 | Canon Inc | ウェハの吸着固定方法 |
-
1985
- 1985-01-30 JP JP60015797A patent/JPS61174734A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5898941A (ja) * | 1981-11-30 | 1983-06-13 | テンコ−・インストルメンツ | ウエ−ハ・チヤツク |
| JPS5946030A (ja) * | 1982-09-08 | 1984-03-15 | Canon Inc | ウェハの吸着固定方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040577A (ja) * | 2008-07-31 | 2010-02-18 | Nikon Corp | 露光方法、デバイスの製造方法及び露光装置 |
| CN110919420A (zh) * | 2019-11-26 | 2020-03-27 | 芜湖诚拓汽车部件股份有限公司 | 汽车铸造件自动化生产铸件加工夹持工装 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0152898B2 (enExample) | 1989-11-10 |
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