JPS61174734A - 基体吸着法 - Google Patents

基体吸着法

Info

Publication number
JPS61174734A
JPS61174734A JP60015797A JP1579785A JPS61174734A JP S61174734 A JPS61174734 A JP S61174734A JP 60015797 A JP60015797 A JP 60015797A JP 1579785 A JP1579785 A JP 1579785A JP S61174734 A JPS61174734 A JP S61174734A
Authority
JP
Japan
Prior art keywords
substrate
adsorption
adsorption method
section
item
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60015797A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0152898B2 (enExample
Inventor
Kunihiko Ueno
邦彦 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP60015797A priority Critical patent/JPS61174734A/ja
Publication of JPS61174734A publication Critical patent/JPS61174734A/ja
Publication of JPH0152898B2 publication Critical patent/JPH0152898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60015797A 1985-01-30 1985-01-30 基体吸着法 Granted JPS61174734A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60015797A JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60015797A JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Publications (2)

Publication Number Publication Date
JPS61174734A true JPS61174734A (ja) 1986-08-06
JPH0152898B2 JPH0152898B2 (enExample) 1989-11-10

Family

ID=11898828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60015797A Granted JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Country Status (1)

Country Link
JP (1) JPS61174734A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040577A (ja) * 2008-07-31 2010-02-18 Nikon Corp 露光方法、デバイスの製造方法及び露光装置
CN110919420A (zh) * 2019-11-26 2020-03-27 芜湖诚拓汽车部件股份有限公司 汽车铸造件自动化生产铸件加工夹持工装

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898941A (ja) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ ウエ−ハ・チヤツク
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898941A (ja) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ ウエ−ハ・チヤツク
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040577A (ja) * 2008-07-31 2010-02-18 Nikon Corp 露光方法、デバイスの製造方法及び露光装置
CN110919420A (zh) * 2019-11-26 2020-03-27 芜湖诚拓汽车部件股份有限公司 汽车铸造件自动化生产铸件加工夹持工装

Also Published As

Publication number Publication date
JPH0152898B2 (enExample) 1989-11-10

Similar Documents

Publication Publication Date Title
JP2002107911A (ja) 露光用マスクの製造方法
JP4286194B2 (ja) ペリクルフレーム、および該フレームを用いたフォトリソグラフィー用ペリクル
JP2914315B2 (ja) 走査型縮小投影露光装置及びディストーション測定方法
KR101143628B1 (ko) 펠리클, 펠리클을 포함하는 포토마스크, 포토마스크의 제조방법
JPH0152898B2 (enExample)
JP3956245B2 (ja) フォトマスク装置
JPH05267116A (ja) ウェハチャックの取り付け構造
JP3068398B2 (ja) レチクルの製造方法およびその製造装置
JPH08167570A (ja) 露光方法
JPH0664337B2 (ja) 半導体集積回路用ホトマスク
JP3120345B2 (ja) 位相シフトマスク及び半導体装置
JP3273157B2 (ja) Ｘ線マスクの製造治具およびそれを用いたｘ線マスクの製造方法
JPH0545710U (ja) ペリクル用フレーム
JPH0329313A (ja) Ｘ線マスクおよびその製造方法
JP5187524B2 (ja) フォトマスク基板の作製方法
JP2917911B2 (ja) フォトマスク及びその作製方法
JPH04136855A (ja) 露光用マスクの製造方法
JP2004029403A (ja) フォトマスクの製造方法及びフォトマスク並びに露光方法
JP2002072447A (ja) 半導体装置の製造方法
JP2004186369A (ja) 転写マスクブランク、転写マスク並びにその転写マスクを用いた転写方法
JPH0437113A (ja) 縮小投影露光装置
JPS6354722A (ja) フオトリソグラフイ用ワ−キングマスクの製造方法
JP2001083352A (ja) 光導波路の製造方法
JP2003015324A (ja) 露光装置
JPH08213302A (ja) 微細加工方法及びこの加工方法に用いる微細加工用フォトマスク