JPH0152898B2 - - Google Patents

Info

Publication number
JPH0152898B2
JPH0152898B2 JP60015797A JP1579785A JPH0152898B2 JP H0152898 B2 JPH0152898 B2 JP H0152898B2 JP 60015797 A JP60015797 A JP 60015797A JP 1579785 A JP1579785 A JP 1579785A JP H0152898 B2 JPH0152898 B2 JP H0152898B2
Authority
JP
Japan
Prior art keywords
substrate
adsorption
installation
base
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60015797A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61174734A (ja
Inventor
Kunihiko Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP60015797A priority Critical patent/JPS61174734A/ja
Publication of JPS61174734A publication Critical patent/JPS61174734A/ja
Publication of JPH0152898B2 publication Critical patent/JPH0152898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP60015797A 1985-01-30 1985-01-30 基体吸着法 Granted JPS61174734A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60015797A JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60015797A JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Publications (2)

Publication Number Publication Date
JPS61174734A JPS61174734A (ja) 1986-08-06
JPH0152898B2 true JPH0152898B2 (enExample) 1989-11-10

Family

ID=11898828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60015797A Granted JPS61174734A (ja) 1985-01-30 1985-01-30 基体吸着法

Country Status (1)

Country Link
JP (1) JPS61174734A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5146183B2 (ja) * 2008-07-31 2013-02-20 株式会社ニコン 露光方法、デバイスの製造方法及び露光装置
CN110919420A (zh) * 2019-11-26 2020-03-27 芜湖诚拓汽车部件股份有限公司 汽车铸造件自动化生产铸件加工夹持工装

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法

Also Published As

Publication number Publication date
JPS61174734A (ja) 1986-08-06

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