JPS6117147B2 - - Google Patents

Info

Publication number
JPS6117147B2
JPS6117147B2 JP770078A JP770078A JPS6117147B2 JP S6117147 B2 JPS6117147 B2 JP S6117147B2 JP 770078 A JP770078 A JP 770078A JP 770078 A JP770078 A JP 770078A JP S6117147 B2 JPS6117147 B2 JP S6117147B2
Authority
JP
Japan
Prior art keywords
ground
connector
printed wiring
wiring board
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP770078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54101165A (en
Inventor
Mitsuo Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP770078A priority Critical patent/JPS54101165A/ja
Publication of JPS54101165A publication Critical patent/JPS54101165A/ja
Publication of JPS6117147B2 publication Critical patent/JPS6117147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP770078A 1978-01-25 1978-01-25 High density integrated circuit Granted JPS54101165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP770078A JPS54101165A (en) 1978-01-25 1978-01-25 High density integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP770078A JPS54101165A (en) 1978-01-25 1978-01-25 High density integrated circuit

Publications (2)

Publication Number Publication Date
JPS54101165A JPS54101165A (en) 1979-08-09
JPS6117147B2 true JPS6117147B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-05-06

Family

ID=11673032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP770078A Granted JPS54101165A (en) 1978-01-25 1978-01-25 High density integrated circuit

Country Status (1)

Country Link
JP (1) JPS54101165A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116762A (ja) * 2003-10-07 2005-04-28 Fujitsu Ltd 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128994A (en) * 1981-02-02 1982-08-10 Nippon Electric Co Lsi mounting structure
JPS59113656A (ja) * 1982-12-20 1984-06-30 Mitsubishi Electric Corp 紫外線消去形再書込み可能読出し専用メモリ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116762A (ja) * 2003-10-07 2005-04-28 Fujitsu Ltd 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造
US8164181B2 (en) 2003-10-07 2012-04-24 Fujitsu Semiconductor Limited Semiconductor device packaging structure

Also Published As

Publication number Publication date
JPS54101165A (en) 1979-08-09

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