JPS6116429B2 - - Google Patents
Info
- Publication number
- JPS6116429B2 JPS6116429B2 JP10328282A JP10328282A JPS6116429B2 JP S6116429 B2 JPS6116429 B2 JP S6116429B2 JP 10328282 A JP10328282 A JP 10328282A JP 10328282 A JP10328282 A JP 10328282A JP S6116429 B2 JPS6116429 B2 JP S6116429B2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- thickness
- alloy
- layer
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 57
- 239000010949 copper Substances 0.000 claims description 41
- 229910052709 silver Inorganic materials 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 5
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 99
- 238000007747 plating Methods 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 20
- 239000011247 coating layer Substances 0.000 description 12
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 229910017709 Ni Co Inorganic materials 0.000 description 3
- 229910003267 Ni-Co Inorganic materials 0.000 description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910017937 Ag-Ni Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910017984 Ag—Ni Inorganic materials 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- -1 and cypronickel Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10328282A JPS58221291A (ja) | 1982-06-16 | 1982-06-16 | 電気接続用銀被覆銅材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10328282A JPS58221291A (ja) | 1982-06-16 | 1982-06-16 | 電気接続用銀被覆銅材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58221291A JPS58221291A (ja) | 1983-12-22 |
| JPS6116429B2 true JPS6116429B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-04-30 |
Family
ID=14349972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10328282A Granted JPS58221291A (ja) | 1982-06-16 | 1982-06-16 | 電気接続用銀被覆銅材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58221291A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009079250A (ja) * | 2007-09-26 | 2009-04-16 | Dowa Metaltech Kk | 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法 |
| JP5854574B2 (ja) * | 2008-03-12 | 2016-02-09 | 古河電気工業株式会社 | 電気接点部品用金属材料 |
| JP5391214B2 (ja) * | 2011-01-31 | 2014-01-15 | 古河電気工業株式会社 | 可動接点用銀被覆ステンレス条及びこれを用いたスイッチ |
| JP6046406B2 (ja) | 2011-07-26 | 2016-12-14 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | 高温耐性銀コート基体 |
| JP6438643B2 (ja) * | 2013-02-28 | 2018-12-19 | 株式会社神戸製鋼所 | 電極部材およびその製造方法 |
| JP2014237883A (ja) * | 2013-06-10 | 2014-12-18 | オリエンタル鍍金株式会社 | めっき積層体の製造方法及びめっき積層体 |
| KR102404045B1 (ko) * | 2016-10-24 | 2022-05-30 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 금속 기판 상에 주석 층을 성막하는 방법 및 상기 방법에 의한 상기 주석 층 및 니켈/인 합금 하부층을 포함하는 구조체의 용도 |
| JP7121881B2 (ja) | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| WO2019031549A1 (ja) * | 2017-08-08 | 2019-02-14 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| JP7162341B2 (ja) * | 2018-01-11 | 2022-10-28 | オリエンタル鍍金株式会社 | めっき積層体の製造方法及びめっき積層体 |
| JP7302364B2 (ja) * | 2019-08-05 | 2023-07-04 | 三菱マテリアル株式会社 | コネクタ用端子材及びコネクタ用端子 |
| JP7395389B2 (ja) * | 2020-03-09 | 2023-12-11 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
-
1982
- 1982-06-16 JP JP10328282A patent/JPS58221291A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58221291A (ja) | 1983-12-22 |