JPS61117883A - 多層印刷配線板用基板 - Google Patents
多層印刷配線板用基板Info
- Publication number
- JPS61117883A JPS61117883A JP23992784A JP23992784A JPS61117883A JP S61117883 A JPS61117883 A JP S61117883A JP 23992784 A JP23992784 A JP 23992784A JP 23992784 A JP23992784 A JP 23992784A JP S61117883 A JPS61117883 A JP S61117883A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- multilayer printed
- printed wiring
- wiring board
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 22
- 239000011162 core material Substances 0.000 claims description 18
- 239000004745 nonwoven fabric Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 239000002759 woven fabric Substances 0.000 description 7
- 238000005553 drilling Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992784A JPS61117883A (ja) | 1984-11-14 | 1984-11-14 | 多層印刷配線板用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992784A JPS61117883A (ja) | 1984-11-14 | 1984-11-14 | 多層印刷配線板用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61117883A true JPS61117883A (ja) | 1986-06-05 |
| JPH0570953B2 JPH0570953B2 (enrdf_load_stackoverflow) | 1993-10-06 |
Family
ID=17051907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23992784A Granted JPS61117883A (ja) | 1984-11-14 | 1984-11-14 | 多層印刷配線板用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61117883A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174796A (ja) * | 1985-01-30 | 1986-08-06 | 新神戸電機株式会社 | 多層回路板の製造法 |
| JPS6338298A (ja) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | 多層プリント配線板の穿孔形成方法 |
| JPH047895A (ja) * | 1990-04-25 | 1992-01-13 | Shin Kobe Electric Mach Co Ltd | 多層プリント配線板 |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51661A (ja) * | 1974-06-21 | 1976-01-06 | Matsushita Electric Works Ltd | Dobarisekisoban |
| JPS5133163A (en) * | 1974-08-15 | 1976-03-22 | Sumitomo Bakelite Co | Tasobanno seizohoho |
| JPS5187770A (ja) * | 1975-01-31 | 1976-07-31 | Matsushita Electric Works Ltd | Tasopurintohaisenbanno seizoho |
| JPS5189154A (enrdf_load_stackoverflow) * | 1975-01-31 | 1976-08-04 | ||
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS5574199A (en) * | 1978-11-28 | 1980-06-04 | Mitsubishi Gas Chemical Co | Method of fabricating multilayer printed circuit board |
| JPS5574190A (en) * | 1978-11-29 | 1980-06-04 | Sharp Corp | Photoelectro-converting semiconductor device |
| JPS57129000A (en) * | 1981-02-03 | 1982-08-10 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed circuit board |
| JPS5823760A (ja) * | 1981-08-05 | 1983-02-12 | Takeda Chem Ind Ltd | 柑橘類果皮粉砕物 |
| JPS58122862A (ja) * | 1982-01-15 | 1983-07-21 | 松下電工株式会社 | コンポジツト銅張積層板の製造方法 |
| JPS58151093A (ja) * | 1982-03-02 | 1983-09-08 | 日本無機繊維工業株式会社 | プリント配線基板用ガラス紙 |
| JPS58210691A (ja) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | 金属箔張積層板の製法 |
| JPS59125699A (ja) * | 1983-01-06 | 1984-07-20 | 松下電工株式会社 | 多層印刷配線板の製造法 |
| JPS6158733A (ja) * | 1984-08-31 | 1986-03-26 | 東芝ケミカル株式会社 | 多層基板用内層板 |
-
1984
- 1984-11-14 JP JP23992784A patent/JPS61117883A/ja active Granted
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51661A (ja) * | 1974-06-21 | 1976-01-06 | Matsushita Electric Works Ltd | Dobarisekisoban |
| JPS5133163A (en) * | 1974-08-15 | 1976-03-22 | Sumitomo Bakelite Co | Tasobanno seizohoho |
| JPS5187770A (ja) * | 1975-01-31 | 1976-07-31 | Matsushita Electric Works Ltd | Tasopurintohaisenbanno seizoho |
| JPS5189154A (enrdf_load_stackoverflow) * | 1975-01-31 | 1976-08-04 | ||
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS5574199A (en) * | 1978-11-28 | 1980-06-04 | Mitsubishi Gas Chemical Co | Method of fabricating multilayer printed circuit board |
| JPS5574190A (en) * | 1978-11-29 | 1980-06-04 | Sharp Corp | Photoelectro-converting semiconductor device |
| JPS57129000A (en) * | 1981-02-03 | 1982-08-10 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed circuit board |
| JPS5823760A (ja) * | 1981-08-05 | 1983-02-12 | Takeda Chem Ind Ltd | 柑橘類果皮粉砕物 |
| JPS58122862A (ja) * | 1982-01-15 | 1983-07-21 | 松下電工株式会社 | コンポジツト銅張積層板の製造方法 |
| JPS58151093A (ja) * | 1982-03-02 | 1983-09-08 | 日本無機繊維工業株式会社 | プリント配線基板用ガラス紙 |
| JPS58210691A (ja) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | 金属箔張積層板の製法 |
| JPS59125699A (ja) * | 1983-01-06 | 1984-07-20 | 松下電工株式会社 | 多層印刷配線板の製造法 |
| JPS6158733A (ja) * | 1984-08-31 | 1986-03-26 | 東芝ケミカル株式会社 | 多層基板用内層板 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174796A (ja) * | 1985-01-30 | 1986-08-06 | 新神戸電機株式会社 | 多層回路板の製造法 |
| JPS6338298A (ja) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | 多層プリント配線板の穿孔形成方法 |
| JPH047895A (ja) * | 1990-04-25 | 1992-01-13 | Shin Kobe Electric Mach Co Ltd | 多層プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570953B2 (enrdf_load_stackoverflow) | 1993-10-06 |
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