JPS6094836U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6094836U JPS6094836U JP1983187219U JP18721983U JPS6094836U JP S6094836 U JPS6094836 U JP S6094836U JP 1983187219 U JP1983187219 U JP 1983187219U JP 18721983 U JP18721983 U JP 18721983U JP S6094836 U JPS6094836 U JP S6094836U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- lead
- protrusion
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983187219U JPS6094836U (ja) | 1983-12-02 | 1983-12-02 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983187219U JPS6094836U (ja) | 1983-12-02 | 1983-12-02 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6094836U true JPS6094836U (ja) | 1985-06-28 |
| JPH0142345Y2 JPH0142345Y2 (enExample) | 1989-12-12 |
Family
ID=30404181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983187219U Granted JPS6094836U (ja) | 1983-12-02 | 1983-12-02 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094836U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62165959A (ja) * | 1986-01-17 | 1987-07-22 | Hitachi Ltd | 半導体装置およびそのリ−ドフレ−ム |
-
1983
- 1983-12-02 JP JP1983187219U patent/JPS6094836U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62165959A (ja) * | 1986-01-17 | 1987-07-22 | Hitachi Ltd | 半導体装置およびそのリ−ドフレ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142345Y2 (enExample) | 1989-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (ja) | 半導体装置 | |
| JPS6094836U (ja) | 半導体装置 | |
| JPS6117751U (ja) | テ−プキヤリア半導体装置 | |
| JPS59145047U (ja) | 半導体装置 | |
| JPS6094835U (ja) | 半導体装置 | |
| JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
| JPS6068654U (ja) | 半導体装置 | |
| JPS6142861U (ja) | 半導体装置 | |
| JPS6144835U (ja) | 半導体装置 | |
| JPS5958941U (ja) | 半導体装置 | |
| JPS5869952U (ja) | 樹脂封止半導体装置 | |
| JPS58184840U (ja) | 半導体装置 | |
| JPS58180661U (ja) | 電子回路基板 | |
| JPS5954952U (ja) | 半導体装置 | |
| JPS5892739U (ja) | 半導体装置 | |
| JPS5996851U (ja) | 半導体装置 | |
| JPS6027444U (ja) | 樹脂封止形半導体装置 | |
| JPS6083258U (ja) | 樹脂封止型半導体装置 | |
| JPS594636U (ja) | 半導体装置 | |
| JPS60136155U (ja) | 半導体装置 | |
| JPS5878660U (ja) | 集積回路 | |
| JPS59112955U (ja) | 半導体素子 | |
| JPS58120661U (ja) | 半導体装置 | |
| JPS5844844U (ja) | 半導体装置 | |
| JPS6081664U (ja) | 集積回路パツケ−ジ |