JPS6082673A - 耐めつき性ソルダレジストインク組成物 - Google Patents

耐めつき性ソルダレジストインク組成物

Info

Publication number
JPS6082673A
JPS6082673A JP58190756A JP19075683A JPS6082673A JP S6082673 A JPS6082673 A JP S6082673A JP 58190756 A JP58190756 A JP 58190756A JP 19075683 A JP19075683 A JP 19075683A JP S6082673 A JPS6082673 A JP S6082673A
Authority
JP
Japan
Prior art keywords
compound
resist ink
ethyl
ink composition
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58190756A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216935B2 (enrdf_load_stackoverflow
Inventor
Isamu Tanaka
勇 田中
Hiroshi Kikuchi
廣 菊池
Akira Tomizawa
明 富沢
Hitoshi Oka
岡　齊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58190756A priority Critical patent/JPS6082673A/ja
Priority to US06/659,565 priority patent/US4555532A/en
Priority to KR1019840006249A priority patent/KR860001555B1/ko
Priority to DE8484112269T priority patent/DE3481064D1/de
Priority to EP84112269A priority patent/EP0138209B1/en
Publication of JPS6082673A publication Critical patent/JPS6082673A/ja
Publication of JPH0216935B2 publication Critical patent/JPH0216935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Epoxy Resins (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP58190756A 1983-10-14 1983-10-14 耐めつき性ソルダレジストインク組成物 Granted JPS6082673A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58190756A JPS6082673A (ja) 1983-10-14 1983-10-14 耐めつき性ソルダレジストインク組成物
US06/659,565 US4555532A (en) 1983-10-14 1984-10-10 Epoxy resin composition
KR1019840006249A KR860001555B1 (ko) 1983-10-14 1984-10-10 에폭시 수지 조성물
DE8484112269T DE3481064D1 (de) 1983-10-14 1984-10-12 Epoxydharzzusammensetzung.
EP84112269A EP0138209B1 (en) 1983-10-14 1984-10-12 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58190756A JPS6082673A (ja) 1983-10-14 1983-10-14 耐めつき性ソルダレジストインク組成物

Publications (2)

Publication Number Publication Date
JPS6082673A true JPS6082673A (ja) 1985-05-10
JPH0216935B2 JPH0216935B2 (enrdf_load_stackoverflow) 1990-04-18

Family

ID=16263207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58190756A Granted JPS6082673A (ja) 1983-10-14 1983-10-14 耐めつき性ソルダレジストインク組成物

Country Status (1)

Country Link
JP (1) JPS6082673A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123666A (ja) * 1984-07-13 1986-02-01 Hitachi Ltd 耐めつきソルダレジストインク組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412841A (en) * 1977-06-30 1979-01-30 Canon Inc Static charge developing toner
JPS56157471A (en) * 1980-05-09 1981-12-04 Hitachi Ltd Resist ink composition for chemical plating
JPS5790072A (en) * 1980-11-25 1982-06-04 Hitachi Ltd Resist ink composition for chemical plating
JPS58147416A (ja) * 1982-02-26 1983-09-02 Hitachi Ltd エポキシ樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412841A (en) * 1977-06-30 1979-01-30 Canon Inc Static charge developing toner
JPS56157471A (en) * 1980-05-09 1981-12-04 Hitachi Ltd Resist ink composition for chemical plating
JPS5790072A (en) * 1980-11-25 1982-06-04 Hitachi Ltd Resist ink composition for chemical plating
JPS58147416A (ja) * 1982-02-26 1983-09-02 Hitachi Ltd エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123666A (ja) * 1984-07-13 1986-02-01 Hitachi Ltd 耐めつきソルダレジストインク組成物

Also Published As

Publication number Publication date
JPH0216935B2 (enrdf_load_stackoverflow) 1990-04-18

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