JPS607484Y2 - 電子部品の樹脂モ−ルド装置 - Google Patents
電子部品の樹脂モ−ルド装置Info
- Publication number
- JPS607484Y2 JPS607484Y2 JP585379U JP585379U JPS607484Y2 JP S607484 Y2 JPS607484 Y2 JP S607484Y2 JP 585379 U JP585379 U JP 585379U JP 585379 U JP585379 U JP 585379U JP S607484 Y2 JPS607484 Y2 JP S607484Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- resin molding
- resin
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 title claims description 28
- 229920005989 resin Polymers 0.000 title claims description 28
- 238000000465 moulding Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585379U JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585379U JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55105951U JPS55105951U (enExample) | 1980-07-24 |
| JPS607484Y2 true JPS607484Y2 (ja) | 1985-03-13 |
Family
ID=28812105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP585379U Expired JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607484Y2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596844U (ja) * | 1982-07-05 | 1984-01-17 | 日本電気株式会社 | 樹脂封止型半導体装置 |
| JPS63211638A (ja) * | 1988-01-08 | 1988-09-02 | Nec Home Electronics Ltd | 樹脂封止型半導体装置の製造方法 |
-
1979
- 1979-01-18 JP JP585379U patent/JPS607484Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55105951U (enExample) | 1980-07-24 |
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