JPS55105951U - - Google Patents
Info
- Publication number
- JPS55105951U JPS55105951U JP585379U JP585379U JPS55105951U JP S55105951 U JPS55105951 U JP S55105951U JP 585379 U JP585379 U JP 585379U JP 585379 U JP585379 U JP 585379U JP S55105951 U JPS55105951 U JP S55105951U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585379U JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585379U JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55105951U true JPS55105951U (enExample) | 1980-07-24 |
| JPS607484Y2 JPS607484Y2 (ja) | 1985-03-13 |
Family
ID=28812105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP585379U Expired JPS607484Y2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の樹脂モ−ルド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607484Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596844U (ja) * | 1982-07-05 | 1984-01-17 | 日本電気株式会社 | 樹脂封止型半導体装置 |
| JPS63211638A (ja) * | 1988-01-08 | 1988-09-02 | Nec Home Electronics Ltd | 樹脂封止型半導体装置の製造方法 |
-
1979
- 1979-01-18 JP JP585379U patent/JPS607484Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596844U (ja) * | 1982-07-05 | 1984-01-17 | 日本電気株式会社 | 樹脂封止型半導体装置 |
| JPS63211638A (ja) * | 1988-01-08 | 1988-09-02 | Nec Home Electronics Ltd | 樹脂封止型半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS607484Y2 (ja) | 1985-03-13 |