JPS6070766A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6070766A
JPS6070766A JP58179647A JP17964783A JPS6070766A JP S6070766 A JPS6070766 A JP S6070766A JP 58179647 A JP58179647 A JP 58179647A JP 17964783 A JP17964783 A JP 17964783A JP S6070766 A JPS6070766 A JP S6070766A
Authority
JP
Japan
Prior art keywords
layer
drain
gate electrode
source
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58179647A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0586673B2 (en, 2012
Inventor
Tatsuro Okamoto
岡本　龍郎
Koji Eguchi
江口　剛治
Saburo Osaki
大崎　三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58179647A priority Critical patent/JPS6070766A/ja
Priority to US06/627,470 priority patent/US4710790A/en
Priority to DE3426306A priority patent/DE3426306A1/de
Priority to DE3448122A priority patent/DE3448122C2/de
Publication of JPS6070766A publication Critical patent/JPS6070766A/ja
Publication of JPH0586673B2 publication Critical patent/JPH0586673B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/025—Manufacture or treatment forming recessed gates, e.g. by using local oxidation
    • H10D64/027—Manufacture or treatment forming recessed gates, e.g. by using local oxidation by etching at gate locations

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP58179647A 1983-09-26 1983-09-26 半導体装置の製造方法 Granted JPS6070766A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58179647A JPS6070766A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法
US06/627,470 US4710790A (en) 1983-09-26 1984-07-03 MOS transistor
DE3426306A DE3426306A1 (de) 1983-09-26 1984-07-17 Mos-transistor und verfahren zu seiner herstellung
DE3448122A DE3448122C2 (en, 2012) 1983-09-26 1984-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58179647A JPS6070766A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6070766A true JPS6070766A (ja) 1985-04-22
JPH0586673B2 JPH0586673B2 (en, 2012) 1993-12-13

Family

ID=16069422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58179647A Granted JPS6070766A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US4710790A (en, 2012)
JP (1) JPS6070766A (en, 2012)
DE (2) DE3448122C2 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049407A (ja) * 2009-08-28 2011-03-10 National Institute Of Advanced Industrial Science & Technology リセスゲート構造を有する絶縁ゲート型炭化珪素ラテラル電界効果トランジスタ

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835584A (en) * 1986-11-27 1989-05-30 American Telephone And Telegraph Company, At&T Bell Laboratories Trench transistor
JPH0640583B2 (ja) * 1987-07-16 1994-05-25 株式会社東芝 半導体装置の製造方法
FR2635408B1 (fr) * 1988-08-11 1992-04-10 Sgs Thomson Microelectronics Memoire de type eprom a haute densite d'integration
FR2635411A1 (fr) * 1988-08-11 1990-02-16 Sgs Thomson Microelectronics Memoire de type eprom a haute densite d'integration avec une organisation en damier, un facteur de couplage ameliore et une possibilite de redondance
FR2635409B1 (fr) * 1988-08-11 1991-08-02 Sgs Thomson Microelectronics Memoire de type eprom a haute densite d'integration possedant un facteur de couplage eleve, et son procede de fabrication
JPH0294477A (ja) * 1988-09-30 1990-04-05 Toshiba Corp 半導体装置及びその製造方法
US5726463A (en) * 1992-08-07 1998-03-10 General Electric Company Silicon carbide MOSFET having self-aligned gate structure
US5929476A (en) 1996-06-21 1999-07-27 Prall; Kirk Semiconductor-on-insulator transistor and memory circuitry employing semiconductor-on-insulator transistors
US5763310A (en) * 1996-10-08 1998-06-09 Advanced Micro Devices, Inc. Integrated circuit employing simultaneously formed isolation and transistor trenches
US6100146A (en) * 1996-10-30 2000-08-08 Advanced Micro Devices, Inc. Method of forming trench transistor with insulative spacers
US6500744B2 (en) * 1999-09-02 2002-12-31 Micron Technology, Inc. Methods of forming DRAM assemblies, transistor devices, and openings in substrates
US6826232B2 (en) 1999-12-20 2004-11-30 Koninklijke Philips Electronics N.V. Fine granular scalable video with embedded DCT coding of the enhancement layer
US6355944B1 (en) * 1999-12-21 2002-03-12 Philips Electronics North America Corporation Silicon carbide LMOSFET with gate reach-through protection
US6838722B2 (en) 2002-03-22 2005-01-04 Siliconix Incorporated Structures of and methods of fabricating trench-gated MIS devices
US9425305B2 (en) 2009-10-20 2016-08-23 Vishay-Siliconix Structures of and methods of fabricating split gate MIS devices
CN102859699B (zh) 2010-03-02 2016-01-06 维西埃-硅化物公司 制造双栅极装置的结构和方法
CN103688363B (zh) 2011-05-18 2017-08-04 威世硅尼克斯公司 半导体器件
US11217541B2 (en) 2019-05-08 2022-01-04 Vishay-Siliconix, LLC Transistors with electrically active chip seal ring and methods of manufacture
US11218144B2 (en) 2019-09-12 2022-01-04 Vishay-Siliconix, LLC Semiconductor device with multiple independent gates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126477A (ja) * 1974-08-29 1976-03-04 Mitsubishi Electric Corp Zetsuengeetogatadenkaikokatoranjisuta
JPS51118383A (en) * 1975-04-10 1976-10-18 Matsushita Electric Ind Co Ltd Manufacturing process for mos type semiconductor unit
JPS55148438A (en) * 1979-05-07 1980-11-19 Ibm Method of fabricating mosfet ram element

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243997A (en) * 1976-03-25 1981-01-06 Tokyo Shibaura Electric Co., Ltd. Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126477A (ja) * 1974-08-29 1976-03-04 Mitsubishi Electric Corp Zetsuengeetogatadenkaikokatoranjisuta
JPS51118383A (en) * 1975-04-10 1976-10-18 Matsushita Electric Ind Co Ltd Manufacturing process for mos type semiconductor unit
JPS55148438A (en) * 1979-05-07 1980-11-19 Ibm Method of fabricating mosfet ram element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049407A (ja) * 2009-08-28 2011-03-10 National Institute Of Advanced Industrial Science & Technology リセスゲート構造を有する絶縁ゲート型炭化珪素ラテラル電界効果トランジスタ

Also Published As

Publication number Publication date
DE3448122C2 (en, 2012) 1993-09-09
DE3426306A1 (de) 1985-04-11
DE3426306C2 (en, 2012) 1987-11-26
JPH0586673B2 (en, 2012) 1993-12-13
US4710790A (en) 1987-12-01

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