JPS6068614A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6068614A
JPS6068614A JP58177245A JP17724583A JPS6068614A JP S6068614 A JPS6068614 A JP S6068614A JP 58177245 A JP58177245 A JP 58177245A JP 17724583 A JP17724583 A JP 17724583A JP S6068614 A JPS6068614 A JP S6068614A
Authority
JP
Japan
Prior art keywords
silicon
aluminum
wiring layer
contact
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58177245A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0441510B2 (member.php
Inventor
Hajime Kamioka
上岡　元
Kazunari Shirai
白井　一成
Shigeo Kashiwagi
柏木　茂雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58177245A priority Critical patent/JPS6068614A/ja
Publication of JPS6068614A publication Critical patent/JPS6068614A/ja
Publication of JPH0441510B2 publication Critical patent/JPH0441510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10D64/011—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58177245A 1983-09-26 1983-09-26 半導体装置の製造方法 Granted JPS6068614A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58177245A JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58177245A JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6068614A true JPS6068614A (ja) 1985-04-19
JPH0441510B2 JPH0441510B2 (member.php) 1992-07-08

Family

ID=16027687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58177245A Granted JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6068614A (member.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843842A (en) * 1991-07-08 1998-12-01 Samsung Electronics Co., Ltd. Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates
US5843843A (en) * 1992-09-07 1998-12-01 Samsung Electronics Co., Ltd. Method for forming a wiring layer a semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186357A (en) * 1981-05-11 1982-11-16 Yamagata Nippon Denki Kk Semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186357A (en) * 1981-05-11 1982-11-16 Yamagata Nippon Denki Kk Semiconductor element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843842A (en) * 1991-07-08 1998-12-01 Samsung Electronics Co., Ltd. Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates
DE4222142B4 (de) * 1991-07-08 2006-08-03 Samsung Electronics Co., Ltd., Suwon Halbleiterbauelement mit einer Verdrahtungsschicht und Verfahren zu dessen Herstellung
US5843843A (en) * 1992-09-07 1998-12-01 Samsung Electronics Co., Ltd. Method for forming a wiring layer a semiconductor device

Also Published As

Publication number Publication date
JPH0441510B2 (member.php) 1992-07-08

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Legal Events

Date Code Title Description
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