JPS606253U - ブリツジ型半導体装置 - Google Patents

ブリツジ型半導体装置

Info

Publication number
JPS606253U
JPS606253U JP1983099161U JP9916183U JPS606253U JP S606253 U JPS606253 U JP S606253U JP 1983099161 U JP1983099161 U JP 1983099161U JP 9916183 U JP9916183 U JP 9916183U JP S606253 U JPS606253 U JP S606253U
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
bridge type
lead wire
metal plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983099161U
Other languages
English (en)
Other versions
JPH0319230Y2 (ja
Inventor
岡村　富雄
進 林
玉川　光英
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1983099161U priority Critical patent/JPS606253U/ja
Publication of JPS606253U publication Critical patent/JPS606253U/ja
Application granted granted Critical
Publication of JPH0319230Y2 publication Critical patent/JPH0319230Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂ、　　ｃは従来装置の平面図、側面図
及び電気的等価回路図、第２図ａ、　　ｂ、　　ｃは本
考案の一実施例を示す平面図、側面図及び部品図である
。 図において１ａ〜１ｄはリードフレーム、２ａ。 ２ｂは接続子、３は封止樹脂、ｄ□〜ｄ４は半導体チッ
プ、１１．１２はコ字状金属板、ｌｌａ、ｊ２ａは長辺
部、ｌｌｂ、１２ｂは短辺部、１３．１４は接続金属板
、１１０〜１４Ｃはリード線部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属板間に半導体チップを接着してブリッジ回路を形成
    し、これを樹脂封止するようにしたブリッジ型半導体装
    置において、長辺部、短辺部及び前記−辺部に連らなる
    リード線部を有する略コ字状金属板の一対を夫々互いに
    長辺部と短辺部が並置する如く配置すると共に前記各辺
    部に夫々はぼ列状をなす如く半導体チップを接着し、又
    前記隣接する長辺部及び短辺部上の半導体チップに跨っ
    て接着され、且つ一端にリード線部を有する一対の接続
    金属板によりブリッジ回路を形成して夫々半導体チップ
    からの発生熱を前記夫々リード線部にほぼ均等に分担せ
    しめるようにしたことを特徴とするブリッジ型半導体装
    置。
JP1983099161U 1983-06-27 1983-06-27 ブリツジ型半導体装置 Granted JPS606253U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983099161U JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983099161U JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Publications (2)

Publication Number Publication Date
JPS606253U true JPS606253U (ja) 1985-01-17
JPH0319230Y2 JPH0319230Y2 (ja) 1991-04-23

Family

ID=30235116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983099161U Granted JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Country Status (1)

Country Link
JP (1) JPS606253U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置
JP2013102005A (ja) * 2011-11-07 2013-05-23 Shindengen Electric Mfg Co Ltd 半導体装置の製造方法、半導体装置及び半導体装置の製造用治具
WO2020194480A1 (ja) * 2019-03-25 2020-10-01 新電元工業株式会社 半導体装置、リードフレーム及び電源装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5446473A (en) * 1977-08-24 1979-04-12 Siemens Ag Method of producing semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5446473A (en) * 1977-08-24 1979-04-12 Siemens Ag Method of producing semiconductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置
JP2013102005A (ja) * 2011-11-07 2013-05-23 Shindengen Electric Mfg Co Ltd 半導体装置の製造方法、半導体装置及び半導体装置の製造用治具
WO2020194480A1 (ja) * 2019-03-25 2020-10-01 新電元工業株式会社 半導体装置、リードフレーム及び電源装置
TWI781377B (zh) * 2019-03-25 2022-10-21 日商新電元工業股份有限公司 半導體裝置、引線框及電源裝置

Also Published As

Publication number Publication date
JPH0319230Y2 (ja) 1991-04-23

Similar Documents

Publication Publication Date Title
JPS606253U (ja) ブリツジ型半導体装置
JP3316409B2 (ja) 複数のｉｃチップを備えた半導体装置の構造
JPS60129136U (ja) 半導体装置
JPS619840U (ja) 樹脂封止型半導体装置
JPH06103731B2 (ja) 半導体パッケ−ジ
JPS6214689Y2 (ja)
JPS6120059U (ja) 半導体装置
JPH0222998Y2 (ja)
JPS609226U (ja) 半導体の実装用パツケ−ジ
JPS6039254U (ja) 半導体集積回路装置
JPS60174254U (ja) 電力用半導体装置
JPS60133632U (ja) 半導体素子の実装構造
JPS6033457U (ja) 半導体装置
JPS5869958U (ja) ハイブリツドｉｃの多重パツケ−ジ構造
JPS59112954U (ja) 絶縁物封止半導体装置
JPS6063947U (ja) 半導体集積回路容器
JPS6120079U (ja) 半導体装置実装用基板
JPS59143050U (ja) 半導体装置
JPS6052634U (ja) 半導体装置
JPS6117745U (ja) Ｌｓｉパツケ−ジ
JPS5842940U (ja) 混成集積回路装置
JPS6030539U (ja) 半導体装置
JPS58168148U (ja) パツケ−ジ
JPS60127935U (ja) サ−マルヘツド
JPS59191743U (ja) Ｉｃパツケ−ジ