JPS6049634A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6049634A
JPS6049634A JP58157452A JP15745283A JPS6049634A JP S6049634 A JPS6049634 A JP S6049634A JP 58157452 A JP58157452 A JP 58157452A JP 15745283 A JP15745283 A JP 15745283A JP S6049634 A JPS6049634 A JP S6049634A
Authority
JP
Japan
Prior art keywords
resin
chip
substrate
heated
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58157452A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6353691B2 (enExample
Inventor
Nobuhisa Ishida
暢久 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58157452A priority Critical patent/JPS6049634A/ja
Publication of JPS6049634A publication Critical patent/JPS6049634A/ja
Publication of JPS6353691B2 publication Critical patent/JPS6353691B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/5366—
    • H10W74/00—
    • H10W74/10—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58157452A 1983-08-29 1983-08-29 半導体装置の製造方法 Granted JPS6049634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58157452A JPS6049634A (ja) 1983-08-29 1983-08-29 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58157452A JPS6049634A (ja) 1983-08-29 1983-08-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6049634A true JPS6049634A (ja) 1985-03-18
JPS6353691B2 JPS6353691B2 (enExample) 1988-10-25

Family

ID=15649964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58157452A Granted JPS6049634A (ja) 1983-08-29 1983-08-29 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6049634A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136534A (ja) * 1986-11-27 1988-06-08 Nec Corp 半導体装置
JP2011199110A (ja) * 2010-03-23 2011-10-06 Mitsubishi Electric Corp パワー半導体装置及びその製造方法
JP2014222695A (ja) * 2013-05-13 2014-11-27 アオイ電子株式会社 半導体装置およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136534A (ja) * 1986-11-27 1988-06-08 Nec Corp 半導体装置
JP2011199110A (ja) * 2010-03-23 2011-10-06 Mitsubishi Electric Corp パワー半導体装置及びその製造方法
JP2014222695A (ja) * 2013-05-13 2014-11-27 アオイ電子株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS6353691B2 (enExample) 1988-10-25

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