JPS6046090A - 電子回路基板 - Google Patents

電子回路基板

Info

Publication number
JPS6046090A
JPS6046090A JP15301583A JP15301583A JPS6046090A JP S6046090 A JPS6046090 A JP S6046090A JP 15301583 A JP15301583 A JP 15301583A JP 15301583 A JP15301583 A JP 15301583A JP S6046090 A JPS6046090 A JP S6046090A
Authority
JP
Japan
Prior art keywords
board
electronic circuit
hole
electrode
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15301583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219635B2 (en, 2012
Inventor
幸一 置田
哲朗 後藤
浩輔 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Sharp Corp
Original Assignee
Nikon Corp
Sharp Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Sharp Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP15301583A priority Critical patent/JPS6046090A/ja
Publication of JPS6046090A publication Critical patent/JPS6046090A/ja
Publication of JPH0219635B2 publication Critical patent/JPH0219635B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP15301583A 1983-08-24 1983-08-24 電子回路基板 Granted JPS6046090A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15301583A JPS6046090A (ja) 1983-08-24 1983-08-24 電子回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15301583A JPS6046090A (ja) 1983-08-24 1983-08-24 電子回路基板

Publications (2)

Publication Number Publication Date
JPS6046090A true JPS6046090A (ja) 1985-03-12
JPH0219635B2 JPH0219635B2 (en, 2012) 1990-05-02

Family

ID=15553092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15301583A Granted JPS6046090A (ja) 1983-08-24 1983-08-24 電子回路基板

Country Status (1)

Country Link
JP (1) JPS6046090A (en, 2012)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01261884A (ja) * 1988-04-13 1989-10-18 Matsushita Electric Ind Co Ltd 電子部品用基板
JPH02133987A (ja) * 1988-11-15 1990-05-23 Taiyo Yuden Co Ltd 回路基板とその製造方法
JPH0342032U (en, 2012) * 1989-08-31 1991-04-22
JPH0476077U (en, 2012) * 1990-11-16 1992-07-02
JPH058971U (ja) * 1991-07-16 1993-02-05 京セラ株式会社 多数個取りセラミツク基板
JP2002185101A (ja) * 2000-12-12 2002-06-28 Rohm Co Ltd 個片基板の製造方法、および個片基板
JP2002246703A (ja) * 2001-02-13 2002-08-30 Rohm Co Ltd 個片基板の製造方法および個片基板並びに集合基板
WO2025134569A1 (ja) * 2023-12-19 2025-06-26 日本カーバイド工業株式会社 セラミック母基板、及び電子部品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494156A (en, 2012) * 1972-05-01 1974-01-14
JPS5834772U (ja) * 1981-08-31 1983-03-07 太陽誘電株式会社 電気回路装置
JPS58123795A (ja) * 1982-01-19 1983-07-23 アルプス電気株式会社 回路基板
JPS6021594A (ja) * 1983-07-15 1985-02-02 株式会社東芝 回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494156A (en, 2012) * 1972-05-01 1974-01-14
JPS5834772U (ja) * 1981-08-31 1983-03-07 太陽誘電株式会社 電気回路装置
JPS58123795A (ja) * 1982-01-19 1983-07-23 アルプス電気株式会社 回路基板
JPS6021594A (ja) * 1983-07-15 1985-02-02 株式会社東芝 回路基板の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01261884A (ja) * 1988-04-13 1989-10-18 Matsushita Electric Ind Co Ltd 電子部品用基板
JPH02133987A (ja) * 1988-11-15 1990-05-23 Taiyo Yuden Co Ltd 回路基板とその製造方法
JPH0342032U (en, 2012) * 1989-08-31 1991-04-22
JPH0476077U (en, 2012) * 1990-11-16 1992-07-02
JPH058971U (ja) * 1991-07-16 1993-02-05 京セラ株式会社 多数個取りセラミツク基板
JP2002185101A (ja) * 2000-12-12 2002-06-28 Rohm Co Ltd 個片基板の製造方法、および個片基板
JP2002246703A (ja) * 2001-02-13 2002-08-30 Rohm Co Ltd 個片基板の製造方法および個片基板並びに集合基板
WO2025134569A1 (ja) * 2023-12-19 2025-06-26 日本カーバイド工業株式会社 セラミック母基板、及び電子部品の製造方法

Also Published As

Publication number Publication date
JPH0219635B2 (en, 2012) 1990-05-02

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