JPS604524A - エポキシ樹脂用潜在性硬化剤 - Google Patents

エポキシ樹脂用潜在性硬化剤

Info

Publication number
JPS604524A
JPS604524A JP11223283A JP11223283A JPS604524A JP S604524 A JPS604524 A JP S604524A JP 11223283 A JP11223283 A JP 11223283A JP 11223283 A JP11223283 A JP 11223283A JP S604524 A JPS604524 A JP S604524A
Authority
JP
Japan
Prior art keywords
group
compound
curing agent
latent curing
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11223283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0315654B2 (en, 2012
Inventor
Koji Takeuchi
光二 竹内
Masahiro Abe
正博 阿部
Nobuo Ito
伊藤 信男
Kiyomiki Hirai
平井 清幹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP11223283A priority Critical patent/JPS604524A/ja
Priority to DE3382819T priority patent/DE3382819T2/de
Priority to DE3382736T priority patent/DE3382736T2/de
Priority to EP83305398A priority patent/EP0104837B1/en
Priority to EP93109367A priority patent/EP0569044B1/en
Priority to US06/532,901 priority patent/US4542202A/en
Publication of JPS604524A publication Critical patent/JPS604524A/ja
Publication of JPH0315654B2 publication Critical patent/JPH0315654B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
JP11223283A 1982-09-21 1983-06-22 エポキシ樹脂用潜在性硬化剤 Granted JPS604524A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP11223283A JPS604524A (ja) 1983-06-22 1983-06-22 エポキシ樹脂用潜在性硬化剤
DE3382819T DE3382819T2 (de) 1982-09-21 1983-09-15 Latente Härter für Epoxyharze
DE3382736T DE3382736T2 (de) 1982-09-21 1983-09-15 Latente Härter für Epoxyharze.
EP83305398A EP0104837B1 (en) 1982-09-21 1983-09-15 Latent curing agents for epoxy resins
EP93109367A EP0569044B1 (en) 1982-09-21 1983-09-15 Latent curing agents for epoxy resins
US06/532,901 US4542202A (en) 1982-09-21 1983-09-16 Latent curing agents for epoxy resins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11223283A JPS604524A (ja) 1983-06-22 1983-06-22 エポキシ樹脂用潜在性硬化剤

Publications (2)

Publication Number Publication Date
JPS604524A true JPS604524A (ja) 1985-01-11
JPH0315654B2 JPH0315654B2 (en, 2012) 1991-03-01

Family

ID=14581546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11223283A Granted JPS604524A (ja) 1982-09-21 1983-06-22 エポキシ樹脂用潜在性硬化剤

Country Status (1)

Country Link
JP (1) JPS604524A (en, 2012)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152992A (en) * 1980-04-28 1981-11-26 Hitachi Cable Ltd Tin-lead alloy plated lead wire
JPS63183920A (ja) * 1987-01-27 1988-07-29 Somar Corp 液状エポキシ樹脂組成物およびその製造方法
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
JPH03107646A (ja) * 1989-09-19 1991-05-08 Sumitomo Bakelite Co Ltd 回転電動子のバランシング用材料
US5218015A (en) * 1989-10-06 1993-06-08 Somar Corporation Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition based on surface treated zeolites
JP2007297493A (ja) * 2006-04-28 2007-11-15 Adeka Corp エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2014185296A (ja) * 2013-03-25 2014-10-02 Asahi Kasei E-Materials Corp 液状樹脂組成物及び加工品
WO2020110493A1 (ja) 2018-11-27 2020-06-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
WO2021241286A1 (ja) 2020-05-27 2021-12-02 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
WO2022239797A1 (ja) 2021-05-14 2022-11-17 住友化学株式会社 エポキシ樹脂組成物及びその硬化物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164557A (en) * 1982-03-15 1982-10-09 Hitachi Ltd Integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164557A (en) * 1982-03-15 1982-10-09 Hitachi Ltd Integrated circuit device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152992A (en) * 1980-04-28 1981-11-26 Hitachi Cable Ltd Tin-lead alloy plated lead wire
JPS63183920A (ja) * 1987-01-27 1988-07-29 Somar Corp 液状エポキシ樹脂組成物およびその製造方法
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
JPH03107646A (ja) * 1989-09-19 1991-05-08 Sumitomo Bakelite Co Ltd 回転電動子のバランシング用材料
US5218015A (en) * 1989-10-06 1993-06-08 Somar Corporation Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition based on surface treated zeolites
JP2007297493A (ja) * 2006-04-28 2007-11-15 Adeka Corp エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2014185296A (ja) * 2013-03-25 2014-10-02 Asahi Kasei E-Materials Corp 液状樹脂組成物及び加工品
WO2020110493A1 (ja) 2018-11-27 2020-06-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
WO2021241286A1 (ja) 2020-05-27 2021-12-02 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
WO2022239797A1 (ja) 2021-05-14 2022-11-17 住友化学株式会社 エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JPH0315654B2 (en, 2012) 1991-03-01

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