JPS6043664B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6043664B2
JPS6043664B2 JP52068051A JP6805177A JPS6043664B2 JP S6043664 B2 JPS6043664 B2 JP S6043664B2 JP 52068051 A JP52068051 A JP 52068051A JP 6805177 A JP6805177 A JP 6805177A JP S6043664 B2 JPS6043664 B2 JP S6043664B2
Authority
JP
Japan
Prior art keywords
contact
region
contact pad
pad
semiconductor region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52068051A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5310267A (en
Inventor
ベルント・ケルペ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
Deutsche ITT Industries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH filed Critical Deutsche ITT Industries GmbH
Publication of JPS5310267A publication Critical patent/JPS5310267A/ja
Publication of JPS6043664B2 publication Critical patent/JPS6043664B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
JP52068051A 1976-07-15 1977-06-10 半導体装置 Expired JPS6043664B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2631810.5 1976-07-15
DE2631810A DE2631810C3 (de) 1976-07-15 1976-07-15 Planares Halbleiterbauelement

Publications (2)

Publication Number Publication Date
JPS5310267A JPS5310267A (en) 1978-01-30
JPS6043664B2 true JPS6043664B2 (ja) 1985-09-30

Family

ID=5983078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52068051A Expired JPS6043664B2 (ja) 1976-07-15 1977-06-10 半導体装置

Country Status (6)

Country Link
JP (1) JPS6043664B2 (ref)
DE (1) DE2631810C3 (ref)
ES (1) ES460687A1 (ref)
FR (1) FR2358749A1 (ref)
GB (1) GB1535656A (ref)
NL (1) NL183000C (ref)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649557A (en) * 1979-09-28 1981-05-06 Toshiba Corp Integrated circuit for high-frequency oscillation circuit
DE2945670C2 (de) * 1979-11-12 1982-02-11 Siemens AG, 1000 Berlin und 8000 München Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlußpunkten
DE3115856A1 (de) * 1980-04-22 1982-01-21 Ferranti Ltd., Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
JPS57181135A (en) * 1981-04-30 1982-11-08 Nec Home Electronics Ltd Semiconductor device
JPS59144936U (ja) * 1983-03-17 1984-09-27 オムロン株式会社 近接スイツチ
JPS6138935U (ja) * 1984-08-08 1986-03-11 日本電気株式会社 集積回路装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450965A (en) * 1966-05-28 1969-06-17 Sony Corp Semiconductor having reinforced lead structure
GB1277333A (en) * 1969-07-31 1972-06-14 Gen Motors Corp Semiconductor devices
DE2534477C3 (de) * 1975-08-01 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kapazitätsarmer Kontaktierungsfleck

Also Published As

Publication number Publication date
NL183000C (nl) 1988-06-16
FR2358749A1 (fr) 1978-02-10
DE2631810B2 (de) 1978-07-06
DE2631810C3 (de) 1979-03-15
ES460687A1 (es) 1978-06-16
JPS5310267A (en) 1978-01-30
GB1535656A (en) 1978-12-13
NL7707719A (nl) 1978-01-17
NL183000B (nl) 1988-01-18
DE2631810A1 (de) 1978-01-19
FR2358749B1 (ref) 1984-01-27

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