JPS6037610A - 容量性多層導体バーおよびその製造法 - Google Patents

容量性多層導体バーおよびその製造法

Info

Publication number
JPS6037610A
JPS6037610A JP59139734A JP13973484A JPS6037610A JP S6037610 A JPS6037610 A JP S6037610A JP 59139734 A JP59139734 A JP 59139734A JP 13973484 A JP13973484 A JP 13973484A JP S6037610 A JPS6037610 A JP S6037610A
Authority
JP
Japan
Prior art keywords
conductive
dielectric
capacitive
capacitive element
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59139734A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572041B2 (enrdf_load_stackoverflow
Inventor
ジオルジオ・トステイー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mecondor SpA
Original Assignee
Mecondor SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mecondor SpA filed Critical Mecondor SpA
Publication of JPS6037610A publication Critical patent/JPS6037610A/ja
Publication of JPH0572041B2 publication Critical patent/JPH0572041B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/005—Laminated bus-bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49201—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulated Conductors (AREA)
  • Coating With Molten Metal (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Linear Motors (AREA)
JP59139734A 1983-07-06 1984-07-05 容量性多層導体バーおよびその製造法 Granted JPS6037610A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT21954/83A IT1194301B (it) 1983-07-06 1983-07-06 Metodo per la fabbricazioni ad alta capacita' con connessioni elettriche ottenute per la saldatura,e relative barre prodotte secondo tale metodo
IT21954-A/83 1983-07-06

Publications (2)

Publication Number Publication Date
JPS6037610A true JPS6037610A (ja) 1985-02-27
JPH0572041B2 JPH0572041B2 (enrdf_load_stackoverflow) 1993-10-08

Family

ID=11189344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139734A Granted JPS6037610A (ja) 1983-07-06 1984-07-05 容量性多層導体バーおよびその製造法

Country Status (6)

Country Link
US (1) US4584768A (enrdf_load_stackoverflow)
EP (1) EP0131265B1 (enrdf_load_stackoverflow)
JP (1) JPS6037610A (enrdf_load_stackoverflow)
AT (1) ATE52641T1 (enrdf_load_stackoverflow)
DE (2) DE3482227D1 (enrdf_load_stackoverflow)
IT (1) IT1194301B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076320A (ja) * 2007-09-20 2009-04-09 Yaskawa Electric Corp 積層バスバー回路板の製造装置および製造方法、これによって製造されるバスバー、電力変換装置
JP2010519686A (ja) * 2007-02-16 2010-06-03 ワールド プラパティーズ、 インコーポレイテッド 積層母線およびその製造方法
US20190145366A1 (en) * 2016-04-18 2019-05-16 Continental Automotive Gmbh Arrangement of Housing and a Flange

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166867A (en) * 1985-12-31 1992-11-24 Fujitsu Limited Bus bar for a circuit board
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
US6498546B1 (en) * 2000-08-25 2002-12-24 James Leych Lau Utilization of proximity effect in ripple noise filtering
DE102005044392A1 (de) * 2005-09-16 2007-03-29 Siemens Ag Piezoaktor mit verbesserter Verbindung zwischen Aktorkörper und Kontaktstift
KR100731293B1 (ko) * 2006-02-24 2007-06-27 경신공업 주식회사 버스 바의 전기접속부 제조방법 및 제조장치
JP4905254B2 (ja) * 2007-05-25 2012-03-28 トヨタ自動車株式会社 コンデンサ一体バスバーの製造方法
US20100239899A1 (en) * 2009-03-23 2010-09-23 Joe Brown Gauntlet motive battery
US9979173B2 (en) * 2011-04-29 2018-05-22 Ge Energy Power Conversion Technology Limited Bus bar assembly and method of manufacturing same
FR3065575B1 (fr) * 2017-04-20 2020-02-21 Auxel Fabrication d'un dispositif a plaques conductrices
JP6618504B2 (ja) * 2017-04-28 2019-12-11 矢崎総業株式会社 バスバー及びバスバーの製造方法
US10850623B2 (en) 2017-10-30 2020-12-01 Sf Motors, Inc. Stacked electric vehicle inverter cells
US10790758B2 (en) 2018-03-08 2020-09-29 Chongqing Jinkang New Energy Vehicle Co., Ltd. Power converter for electric vehicle drive systems
US10779445B2 (en) 2018-03-23 2020-09-15 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10594230B2 (en) 2018-03-23 2020-03-17 Sf Motors, Inc. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10756649B2 (en) 2018-03-23 2020-08-25 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10778117B2 (en) 2018-04-17 2020-09-15 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module of an electric vehicle
US10772242B2 (en) 2018-04-17 2020-09-08 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module of an electric vehicle
US10600578B2 (en) 2018-04-26 2020-03-24 Sf Motors, Inc. Electric vehicle inverter module capacitors
US10608423B2 (en) * 2018-04-26 2020-03-31 Sf Motors, Inc. Electric vehicle inverter module laminated bus bar
US10600577B2 (en) 2018-04-26 2020-03-24 Sf Motors, Inc. Electric vehicle inverter module capacitors
US10660242B2 (en) 2018-04-26 2020-05-19 Chongqing Jinkang New Energy Vehicle Co., Ltd. Electric vehicle inverter module heat sink
US10998706B2 (en) * 2019-10-08 2021-05-04 Hamilton Sundstrand Corporation Laminated bus bars
US11876364B2 (en) 2022-03-07 2024-01-16 Rolls-Royce Corporation Multilayer electronic components with soldered through holes
US11832390B2 (en) 2022-03-07 2023-11-28 Rolls-Royce Corporation Multilayer copper bus bars with soldered through hole components

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566335U (enrdf_load_stackoverflow) * 1978-10-31 1980-05-07
JPS55111328U (enrdf_load_stackoverflow) * 1979-01-29 1980-08-05
JPS55160417A (en) * 1979-05-31 1980-12-13 Nippon Mektron Kk Capacitor internally containing laminate bus and method of fabricating same
GB2096820A (en) * 1981-03-31 1982-10-20 Rogers Corp Multilayer bus bar

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021451B2 (ja) * 1977-10-08 1985-05-28 日本メクトロン株式会社 コンデンサ内蔵型積層母線
US4236046A (en) * 1978-10-10 1980-11-25 Rogers Corporation High capacitance bus bar
US4236038A (en) * 1979-07-19 1980-11-25 Rogers Corporation High capacitance multilayer bus bar and method of manufacture thereof
US4420653A (en) * 1980-05-29 1983-12-13 Rogers Corporation High capacitance bus bar and method of manufacture thereof
US4399321A (en) * 1981-03-31 1983-08-16 Rogers Corporation High capacitance bus bar including multilayer ceramic capacitors
US4394532A (en) * 1981-03-31 1983-07-19 Rogers Corporation Multilayer current distribution systems and methods of fabrication thereof
US4440972A (en) * 1981-03-31 1984-04-03 Rogers Corporation Miniaturized bus bar with capacitors and method of making same
US4381423A (en) * 1981-03-31 1983-04-26 Rogers Corporation High capacitance bus bar manufacturing technique
US4430522A (en) * 1982-07-16 1984-02-07 Eldre Components, Inc. Laminated bus bar with capacitors and method of making same
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566335U (enrdf_load_stackoverflow) * 1978-10-31 1980-05-07
JPS55111328U (enrdf_load_stackoverflow) * 1979-01-29 1980-08-05
JPS55160417A (en) * 1979-05-31 1980-12-13 Nippon Mektron Kk Capacitor internally containing laminate bus and method of fabricating same
GB2096820A (en) * 1981-03-31 1982-10-20 Rogers Corp Multilayer bus bar

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010519686A (ja) * 2007-02-16 2010-06-03 ワールド プラパティーズ、 インコーポレイテッド 積層母線およびその製造方法
JP2009076320A (ja) * 2007-09-20 2009-04-09 Yaskawa Electric Corp 積層バスバー回路板の製造装置および製造方法、これによって製造されるバスバー、電力変換装置
US20190145366A1 (en) * 2016-04-18 2019-05-16 Continental Automotive Gmbh Arrangement of Housing and a Flange

Also Published As

Publication number Publication date
US4584768A (en) 1986-04-29
EP0131265A3 (en) 1986-08-20
DE131265T1 (de) 1985-08-14
IT1194301B (it) 1988-09-14
IT8321954A0 (it) 1983-07-06
IT8321954A1 (it) 1985-01-06
JPH0572041B2 (enrdf_load_stackoverflow) 1993-10-08
EP0131265B1 (en) 1990-05-09
EP0131265A2 (en) 1985-01-16
DE3482227D1 (de) 1990-06-13
ATE52641T1 (de) 1990-05-15

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