FR3065575B1 - Fabrication d'un dispositif a plaques conductrices - Google Patents

Fabrication d'un dispositif a plaques conductrices Download PDF

Info

Publication number
FR3065575B1
FR3065575B1 FR1700437A FR1700437A FR3065575B1 FR 3065575 B1 FR3065575 B1 FR 3065575B1 FR 1700437 A FR1700437 A FR 1700437A FR 1700437 A FR1700437 A FR 1700437A FR 3065575 B1 FR3065575 B1 FR 3065575B1
Authority
FR
France
Prior art keywords
conductive
current density
conductive plates
zones
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1700437A
Other languages
English (en)
Other versions
FR3065575A1 (fr
Inventor
Jean Francois Wecxsteen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auxel SAS
Original Assignee
Auxel SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auxel SAS filed Critical Auxel SAS
Priority to FR1700437A priority Critical patent/FR3065575B1/fr
Publication of FR3065575A1 publication Critical patent/FR3065575A1/fr
Application granted granted Critical
Publication of FR3065575B1 publication Critical patent/FR3065575B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/02Coating starting from inorganic powder by application of pressure only
    • C23C24/04Impact or kinetic deposition of particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

Procédé de fabrication d'un circuit multicouche de distribution de courant électrique comprenant la fabrication d'une succession de plaques (2) conductrices destinées à être empilées, la mise en place d'une couche (3) isolante électriquement entre les plaques conductrices que l'on empile, ces dites plaques conductrices présentant des zones (5) de contacts destinées à établir une connexion avec un composant et des zones de densité de courant plus importante ; ce procédé étant caractérisé en ce qu'on détermine les zones (9) où la densité de courant est la plus importante et au niveau des dites zones de densité de courant plus importante, on projette dynamiquement à vitesse supersonique et par gaz sous pression au travers d'une tuyère convergente divergente une poudre conductrice électriquement dont les particules de ladite poudre vont se déformer plastiquement, s'incruster et s'agglomérer sur la surface et former une surcouche réduisant localement la résistance électrique de la zone traitée par augmentation de la section de passage et/ou par apport d'un matériau plus conducteur que celui constituant la plaque conductrice.
FR1700437A 2017-04-20 2017-04-20 Fabrication d'un dispositif a plaques conductrices Active FR3065575B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1700437A FR3065575B1 (fr) 2017-04-20 2017-04-20 Fabrication d'un dispositif a plaques conductrices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1700437A FR3065575B1 (fr) 2017-04-20 2017-04-20 Fabrication d'un dispositif a plaques conductrices
FR1700437 2017-04-20

Publications (2)

Publication Number Publication Date
FR3065575A1 FR3065575A1 (fr) 2018-10-26
FR3065575B1 true FR3065575B1 (fr) 2020-02-21

Family

ID=59520958

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1700437A Active FR3065575B1 (fr) 2017-04-20 2017-04-20 Fabrication d'un dispositif a plaques conductrices

Country Status (1)

Country Link
FR (1) FR3065575B1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1194301B (it) * 1983-07-06 1988-09-14 Mecondor Spa Metodo per la fabbricazioni ad alta capacita' con connessioni elettriche ottenute per la saldatura,e relative barre prodotte secondo tale metodo
JP5186528B2 (ja) * 2010-04-23 2013-04-17 日本発條株式会社 導電部材及びその製造方法

Also Published As

Publication number Publication date
FR3065575A1 (fr) 2018-10-26

Similar Documents

Publication Publication Date Title
Xie et al. Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging
WO2018067918A3 (fr) Fabrication additive de composite de fibres métalliques (mfc-am) et structures composites formées par mfc-am
KR101784227B1 (ko) 정전 척의 수리 및 복원을 위한 방법 및 장치
WO2006002010A3 (fr) Revetement de surface de bande d'isolant rubane
JP6660378B2 (ja) コーティング及びテクスチャ加工が施されたピン部材を有するファスナー
TW200632134A (en) Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method
FR3065575B1 (fr) Fabrication d'un dispositif a plaques conductrices
JP2018507555A (ja) マスクを用いてコールドガススプレーする方法
FR3054771B1 (fr) Vitrage muni d'un dispositif conducteur electrique avec zones de soudure ameliorees
FR3059467B1 (fr) Transistor a heterojonction a structure verticale
CN100468875C (zh) 用于提高电连接使用寿命的接触装置
Skvortsov et al. Diagnostics of degradation processes in the metal-semiconductor system
ATE509353T1 (de) Hochspannungsdurchführung
FR3082050B1 (fr) Via interne avec contact ameliore pour couche semi-conductrice superieure d'un circuit 3d
FR3065617B1 (fr) Procede de fabrication d'un circuit multicouches pour la distribution de courant electrique
Antipov et al. Electrical properties of metal cluster structures formed on the surface of dielectrics
US20200161212A1 (en) Power module and method for manufacturing power module
Thomas et al. Modelling of surface roughness in coated wire electric discharge machining through response surface methodology
JP2019186319A5 (fr)
Hsiao et al. Failure mechanism for fine pitch microbump in Cu/Sn/Cu system during current stressing
EP3966850A1 (fr) Procede de fabrication d'un module electronique de puissance
FR3074609B1 (fr) Capteur de fissure dans un plot de soudure, et procede de controle de qualite de production
KR101574880B1 (ko) 금속기재의 표면처리장치 및 그 방법
FR3073075B1 (fr) Point memoire a materiau a changement de phase
FR3036917A1 (fr) Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20181026

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

RM Correction of a material error

Effective date: 20210609

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8