JPS60208484A - エツチングレジストインキ - Google Patents
エツチングレジストインキInfo
- Publication number
- JPS60208484A JPS60208484A JP6327384A JP6327384A JPS60208484A JP S60208484 A JPS60208484 A JP S60208484A JP 6327384 A JP6327384 A JP 6327384A JP 6327384 A JP6327384 A JP 6327384A JP S60208484 A JPS60208484 A JP S60208484A
- Authority
- JP
- Japan
- Prior art keywords
- resins
- ink
- meth
- resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Formation Of Insulating Films (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6327384A JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6327384A JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60208484A true JPS60208484A (ja) | 1985-10-21 |
| JPH0348276B2 JPH0348276B2 (enExample) | 1991-07-23 |
Family
ID=13224528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6327384A Granted JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60208484A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03281790A (ja) * | 1990-03-29 | 1991-12-12 | G T C:Kk | エッチングレジストパターンの形成方法 |
| JP2010217910A (ja) * | 2002-11-06 | 2010-09-30 | Asahi Glass Co Ltd | 隔壁形成用ネガ型感光性樹脂組成物 |
| GB2540121A (en) * | 2015-05-29 | 2017-01-11 | Innovation Tech Coatings Ltd | Photosensitive film |
-
1984
- 1984-04-02 JP JP6327384A patent/JPS60208484A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03281790A (ja) * | 1990-03-29 | 1991-12-12 | G T C:Kk | エッチングレジストパターンの形成方法 |
| JP2010217910A (ja) * | 2002-11-06 | 2010-09-30 | Asahi Glass Co Ltd | 隔壁形成用ネガ型感光性樹脂組成物 |
| GB2540121A (en) * | 2015-05-29 | 2017-01-11 | Innovation Tech Coatings Ltd | Photosensitive film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0348276B2 (enExample) | 1991-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW449611B (en) | Photocurable and thermosetting matte liquid resist composition | |
| US6045973A (en) | Photoimageable compositions having improved chemical resistance and stripping ability | |
| WO2001004705A1 (en) | Alkali development type photocurable composition and pattern of burned matter obtained from the same | |
| JPH0154390B2 (enExample) | ||
| JPH0644150B2 (ja) | プリント配線フオトレジスト用電着塗料組成物 | |
| JPS6412376B2 (enExample) | ||
| JPS59204036A (ja) | レジストパタ−ンの形成法 | |
| JP2604173B2 (ja) | 耐熱性感光性樹脂組成物 | |
| EP0180466B1 (en) | Photopolymerizable composition for use as an etching-resist ink | |
| JPS60208484A (ja) | エツチングレジストインキ | |
| JP3686699B2 (ja) | アルカリ現像型の光硬化性・熱硬化性樹脂組成物 | |
| JPS59170165A (ja) | 紫外線硬化型組成物 | |
| JPH0336211B2 (enExample) | ||
| US6555592B2 (en) | Photothermosetting composition comprising acrylated epoxy resin | |
| JP2008019336A (ja) | 光硬化性・熱硬化性の一液型ソルダーレジスト組成物及びそれを用いたプリント配線板 | |
| JP3403511B2 (ja) | レジストパターン及びエッチングパターンの製造方法 | |
| JPH02153902A (ja) | 硬化性組成物 | |
| JPH0767008B2 (ja) | ソルダーレジストパターン形成方法 | |
| JPH0252634B2 (enExample) | ||
| JP2651671B2 (ja) | 紫外線硬化型インキ組成物 | |
| JPS6039889A (ja) | レジストパタ−ンの形成方法 | |
| JP2540921B2 (ja) | 硬化性組成物 | |
| JPH06192387A (ja) | 活性エネルギー線硬化性樹脂 | |
| JPS61223073A (ja) | 活性エネルギ−線硬化性被覆組成物 | |
| JP2766861B2 (ja) | 感光性樹脂組成物 |