JPH0348276B2 - - Google Patents
Info
- Publication number
- JPH0348276B2 JPH0348276B2 JP6327384A JP6327384A JPH0348276B2 JP H0348276 B2 JPH0348276 B2 JP H0348276B2 JP 6327384 A JP6327384 A JP 6327384A JP 6327384 A JP6327384 A JP 6327384A JP H0348276 B2 JPH0348276 B2 JP H0348276B2
- Authority
- JP
- Japan
- Prior art keywords
- resins
- parts
- meth
- ink
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Formation Of Insulating Films (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6327384A JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6327384A JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60208484A JPS60208484A (ja) | 1985-10-21 |
| JPH0348276B2 true JPH0348276B2 (enExample) | 1991-07-23 |
Family
ID=13224528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6327384A Granted JPS60208484A (ja) | 1984-04-02 | 1984-04-02 | エツチングレジストインキ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60208484A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03281790A (ja) * | 1990-03-29 | 1991-12-12 | G T C:Kk | エッチングレジストパターンの形成方法 |
| CN1711503B (zh) * | 2002-11-06 | 2010-05-26 | 旭硝子株式会社 | 负型感光性树脂组合物用于制造隔壁的用途 |
| GB2540121A (en) * | 2015-05-29 | 2017-01-11 | Innovation Tech Coatings Ltd | Photosensitive film |
-
1984
- 1984-04-02 JP JP6327384A patent/JPS60208484A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60208484A (ja) | 1985-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4536468A (en) | Method of forming resist pattern | |
| US3989644A (en) | Radiation curable inks | |
| CN109401426B (zh) | 高柔韧性光固化涂料及其制备方法 | |
| US6458509B1 (en) | Resist compositions | |
| JPH0348276B2 (enExample) | ||
| EP0180466B1 (en) | Photopolymerizable composition for use as an etching-resist ink | |
| JP3686699B2 (ja) | アルカリ現像型の光硬化性・熱硬化性樹脂組成物 | |
| JPS59170165A (ja) | 紫外線硬化型組成物 | |
| US6555592B2 (en) | Photothermosetting composition comprising acrylated epoxy resin | |
| JPH0336211B2 (enExample) | ||
| JPH0252634B2 (enExample) | ||
| JP2002038065A (ja) | 凹版インキ用樹脂組成物、それを用いたインキ組成物及びその印刷物 | |
| WO1996028764A1 (en) | Photosensitive resin composition, and coating film, resist ink, resist, solder resist and printed circuit board each produced therefrom | |
| WO2020189066A1 (ja) | コーティング組成物 | |
| JPS6039890A (ja) | レジストパタ−ンの形成方法 | |
| JP2001013679A (ja) | レジスト組成物 | |
| JPH01168767A (ja) | 活性エネルギー線硬化性被覆組成物 | |
| JPH0251516A (ja) | 活性エネルギー線硬化性樹脂,その樹脂を含む硬化性被覆組成物および印刷インキ用組成物 | |
| JP2651671B2 (ja) | 紫外線硬化型インキ組成物 | |
| JPS6039889A (ja) | レジストパタ−ンの形成方法 | |
| JPS61223073A (ja) | 活性エネルギ−線硬化性被覆組成物 | |
| JPS61239982A (ja) | レジストパタ−ンの形成法 | |
| JPS63264686A (ja) | レジストインキ | |
| JPS5947246A (ja) | 光硬化性組成物 | |
| JP2021024906A (ja) | 光硬化型樹脂組成物 |