JPS60206139A - 半導体材料の水切乾燥装置 - Google Patents

半導体材料の水切乾燥装置

Info

Publication number
JPS60206139A
JPS60206139A JP59063857A JP6385784A JPS60206139A JP S60206139 A JPS60206139 A JP S60206139A JP 59063857 A JP59063857 A JP 59063857A JP 6385784 A JP6385784 A JP 6385784A JP S60206139 A JPS60206139 A JP S60206139A
Authority
JP
Japan
Prior art keywords
semiconductor material
main shaft
gripper
sliding ring
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59063857A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458687B2 (cg-RX-API-DMAC10.html
Inventor
Seiichiro Sogo
相合　征一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP59063857A priority Critical patent/JPS60206139A/ja
Publication of JPS60206139A publication Critical patent/JPS60206139A/ja
Publication of JPH0458687B2 publication Critical patent/JPH0458687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/7608—
    • H10P72/0408—

Landscapes

  • Centrifugal Separators (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP59063857A 1984-03-30 1984-03-30 半導体材料の水切乾燥装置 Granted JPS60206139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59063857A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59063857A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS60206139A true JPS60206139A (ja) 1985-10-17
JPH0458687B2 JPH0458687B2 (cg-RX-API-DMAC10.html) 1992-09-18

Family

ID=13241424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59063857A Granted JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Country Status (1)

Country Link
JP (1) JPS60206139A (cg-RX-API-DMAC10.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (cg-RX-API-DMAC10.html) * 1972-06-10 1974-03-02
JPS5737837A (en) * 1980-08-20 1982-03-02 Toshiba Corp Drying device for semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (cg-RX-API-DMAC10.html) * 1972-06-10 1974-03-02
JPS5737837A (en) * 1980-08-20 1982-03-02 Toshiba Corp Drying device for semiconductor wafer

Also Published As

Publication number Publication date
JPH0458687B2 (cg-RX-API-DMAC10.html) 1992-09-18

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