JPS5737837A - Drying device for semiconductor wafer - Google Patents

Drying device for semiconductor wafer

Info

Publication number
JPS5737837A
JPS5737837A JP11422680A JP11422680A JPS5737837A JP S5737837 A JPS5737837 A JP S5737837A JP 11422680 A JP11422680 A JP 11422680A JP 11422680 A JP11422680 A JP 11422680A JP S5737837 A JPS5737837 A JP S5737837A
Authority
JP
Japan
Prior art keywords
wafer
shaft
spindle
spindle shaft
rotated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11422680A
Other languages
Japanese (ja)
Inventor
Ikuo Nibari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11422680A priority Critical patent/JPS5737837A/en
Publication of JPS5737837A publication Critical patent/JPS5737837A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To uniformly clean and dry the front and back sides of the wafer by a method wherein a structure, with which a part of the circumferential side of the wafer is held by the centrifugal force generated by the revolution of a spindle shaft, is provided. CONSTITUTION:Six wafer fixed arms 16 are provided on the flange 13 located at the point of the spindle shaft 10 using a supporting shaft 15, a weight 17 is attached to the end section of the fixing arms 16 and the lower surface of the wafer is coupled in a body by the aid of a ring 18. Also, the fixing arm 16 is pressed by the spring 19 in the reverse direction of the revolving direction of the spindle shaft 10 and when the device is at a standstill, the stepped section 16a whereon the wafer 20 will be placed is opened. When the wafer 20 is placed and the spindle 10 is rotated, the weight 17 moves away from the shaft 10 and the wafer is tightened fixed by the stepped section 16 of the fixing arm 16. Through these procedures, the wafer is rotated without being vacuum-attracted and can be dried and cleaned up.
JP11422680A 1980-08-20 1980-08-20 Drying device for semiconductor wafer Pending JPS5737837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11422680A JPS5737837A (en) 1980-08-20 1980-08-20 Drying device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11422680A JPS5737837A (en) 1980-08-20 1980-08-20 Drying device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5737837A true JPS5737837A (en) 1982-03-02

Family

ID=14632388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11422680A Pending JPS5737837A (en) 1980-08-20 1980-08-20 Drying device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5737837A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206139A (en) * 1984-03-30 1985-10-17 Seiichiro Sogo Hydroextractor of semiconductor material
JPS6126226A (en) * 1984-07-16 1986-02-05 Shioya Seisakusho:Kk Scribing device
JPS6260027U (en) * 1985-09-04 1987-04-14
JPS6260028U (en) * 1985-09-18 1987-04-14
JPH02721U (en) * 1988-06-14 1990-01-05
JPH02127033U (en) * 1989-03-28 1990-10-19

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206139A (en) * 1984-03-30 1985-10-17 Seiichiro Sogo Hydroextractor of semiconductor material
JPH0458687B2 (en) * 1984-03-30 1992-09-18 Kurotani Nobuko
JPS6126226A (en) * 1984-07-16 1986-02-05 Shioya Seisakusho:Kk Scribing device
JPS6260027U (en) * 1985-09-04 1987-04-14
JPS6260028U (en) * 1985-09-18 1987-04-14
JPH0528760Y2 (en) * 1985-09-18 1993-07-23
JPH02721U (en) * 1988-06-14 1990-01-05
JPH02127033U (en) * 1989-03-28 1990-10-19

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